5SGXMA3H1F35I2N

The 5SGXMA3H1F35I2N is a Stratix V GX family FPGA offered in an industrial temperature grade and packaged in a 1152-ball FCBGA. It provides very high logic density and extensive I/O capability for designs that require large-scale programmable logic and substantial on-chip memory.

This device targets applications that demand high integration, broad I/O counts and sustained operation across an industrial temperature range, with a documented core voltage window for system integration and RoHS compliance for regulatory alignment.

Key Features

• High Logic Density — 340,000 logic elements for large-scale programmable designs and complex logic implementations.
• Embedded Memory — Approximately 19.46 Mbits of embedded memory to support on-chip buffering, state storage, and data-path requirements.
• Extensive I/O — 600 user I/Os to accommodate wide parallel interfaces, multiple peripherals, and high-pin-count system connectivity.
• Power Supply — Core voltage supply specified at 0.870 V to 0.930 V to guide power-system design and voltage-rail planning.
• Industrial Temperature Range — Rated for operation from –40°C to 100°C for deployment in industrial environments.
• Package and Mounting — 1152-ball BBGA / FCBGA package (supplier device package: 1152-FBGA, 35×35) with surface-mount mounting for board-level integration.
• Regulatory Compliance — RoHS compliant to support environmentally restricted manufacturing and procurement requirements.

Typical Applications

• Industrial Control Systems — High logic density and industrial temperature rating make the device suited for control and automation systems requiring robust programmable logic.
• High‑Density Signal Processing — Large embedded memory and abundant logic elements enable on-chip data processing and buffering for signal conditioning and analysis.
• Networking and I/O‑Intensive Systems — With 600 I/Os and Stratix V GX family capabilities, the device supports complex interface mixing and wide parallel connectivity needs.
• Custom Compute and Prototyping — The FPGA architecture and available resources support development of tailored hardware accelerators and system prototypes.

Unique Advantages

• Significant On‑Chip Capacity: 340,000 logic elements combined with approximately 19.46 Mbits of embedded memory reduce reliance on external logic and RAM for compact system designs.
• Broad I/O Count: 600 user I/Os simplify integration of multi-channel interfaces, sensor arrays, and parallel buses without extensive external multiplexing.
• Industrial Reliability: Rated for –40°C to 100°C operation to meet temperature requirements for industrial deployments.
• Clear Power Envelope: Defined core supply range (0.870 V–0.930 V) assists in predictable power delivery and thermal planning during system design.
• Board-Level Compatibility: 1152-ball FCBGA package and surface-mount mounting support standard high-density PCB assembly processes.
• Regulatory Alignment: RoHS compliance facilitates use in regions and programs with environmental restrictions.

Why Choose 5SGXMA3H1F35I2N?

The 5SGXMA3H1F35I2N combines high logic capacity, substantial embedded memory and a large I/O count within an industrial-grade Stratix V GX FPGA package. Its documented operating voltage range and temperature rating make it appropriate for complex, throughput‑oriented designs that must operate reliably across demanding environmental conditions.

This device is suited to engineering teams designing high-density programmable subsystems, industrial controllers, signal processing modules and I/O-rich platforms that require a balance of integration, predictable power requirements and RoHS-compliant packaging. Detailed technical documentation for the Stratix V family is available to support system-level integration and verification.

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