5SGXMA3H2F35C1G

The 5SGXMA3H2F35C1G is a Stratix® V GX field programmable gate array (FPGA) in a 1152-BBGA FCBGA package designed for high-density, high-bandwidth digital designs. With a large logic fabric, substantial embedded memory, and a 600-pin I/O count, this commercial-grade device targets complex system integration where logic capacity, on-chip RAM, and extensive I/O are required.

Key Features

• Core / Logic  Approximately 340,000 logic elements and 128,300 logic blocks for implementing large-scale digital logic and custom accelerators.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support buffering, state storage, and memory-intensive logic functions.
• I/O Density  600 available I/O pins to enable extensive peripheral interfacing and high-channel-count connectivity.
• Power  Core supply voltage range of 870 mV to 930 mV for the device core power domain.
• Package & Mounting  1152-BBGA (FCBGA) package; supplier device package listed as 1152-FBGA (35×35). Surface-mount mounting type suited for modern PCB assembly.
• Operating Conditions  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS-compliant for environmental and manufacturing compatibility.

Typical Applications

• High-density digital systems  Implement complex programmable logic and custom datapaths using the device's large logic and memory resources.
• Networking and communications  Use the high I/O count to interface with multiple high-speed links and external transceivers.
• Compute acceleration  Deploy on-chip memory and extensive logic to accelerate algorithmic workloads and data processing tasks.

Unique Advantages

• Large programmable fabric: The combination of ~340k logic elements and 128,300 logic blocks enables implementation of complex, multi-module designs on a single device.
• Substantial embedded memory: Approximately 19.456 Mbits of on-chip RAM reduces dependence on external memory for many buffering and working-set requirements.
• High I/O capacity: 600 I/O pins provide flexibility for multi-channel interfacing and broad peripheral support without external multiplexing.
• Compact surface-mount package: 1152-BBGA (35×35) packaging balances high pin count with a board-friendly footprint for dense system designs.
• Commercial temperature grade: Rated 0 °C to 85 °C for deployments in commercial and lab environments.
• RoHS compliant: Conforms to lead-free manufacturing requirements for modern electronics production.

Why Choose 5SGXMA3H2F35C1G?

The 5SGXMA3H2F35C1G offers a high-capacity Stratix V GX implementation that brings together substantial logic resources, significant on-chip memory, and extensive I/O in a single surface-mount FCBGA package. It is well suited for engineers building dense, high-performance digital systems that require scalable logic density and broad interfacing capability.

For design teams prioritizing integration and flexibility within commercial temperature ranges, this device provides a balanced platform for complex processing, buffering, and multi-channel connectivity while aligning with RoHS manufacturing requirements.

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