5SGXMA3H2F35C2LG
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 19456000 340000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 98 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 600 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 128300 | Number of Logic Elements/Cells | 340000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 19456000 |
Overview of 5SGXMA3H2F35C2LG – Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 19456000 340000 1152-BBGA, FCBGA
The 5SGXMA3H2F35C2LG is a Stratix V GX field programmable gate array offering very high logic density and abundant on-chip memory for complex digital designs. It combines approximately 340,000 logic elements with roughly 19.456 Mbits of embedded memory and up to 600 I/Os, delivering the resources required for advanced signal processing, protocol handling, and dense interface integration.
Packaged in a 1152-ball FCBGA (1152-FBGA, 35×35) and rated for commercial temperature operation, this device is RoHS compliant and documented in the Stratix V device datasheet for electrical and switching characteristics.
Key Features
- Logic Capacity – Approximately 340,000 logic elements and about 128,300 logic array blocks provide high combinational and sequential logic resources for large, complex designs.
- Embedded Memory – Approximately 19.456 Mbits of on-chip RAM supports large buffers, FIFOs, and shared memory structures without external RAM dependency.
- I/O Resources – Up to 600 I/O pins enable dense external interfacing for multi-protocol connectivity and board-level integration.
- Package & Mounting – 1152-BBGA FCBGA package (supplier package: 1152-FBGA, 35×35) in a surface-mount form factor suitable for high-density PCB layouts.
- Power Supply – Core supply specified between 820 mV and 880 mV to match system power delivery and sequencing requirements.
- Temperature & Grade – Commercial grade operation with an operating temperature range of 0 °C to 85 °C.
- Compliance – RoHS compliant for regulatory and environmental consistency in commercial products.
- Documented Electrical Characteristics – Device behavior, power, and I/O timing are detailed in the Stratix V device datasheet for design and validation.
Typical Applications
- High-performance data processing – Large logic capacity and substantial on-chip RAM support complex packet processing, data path acceleration, and custom compute pipelines.
- High-density interface bridging – Up to 600 I/Os enable aggregation and protocol translation among multiple high-speed interfaces on a single device.
- Telecom and networking modules – The logic density and memory resources suit buffering, framing, and protocol handling in networking equipment.
- Prototyping and system integration – Surface-mount FCBGA packaging and commercial-grade temperature range make this device appropriate for board-level integration and development platforms.
Unique Advantages
- High integration density: Approximately 340,000 logic elements and ~19.456 Mbits of embedded memory reduce the need for external logic and RAM, simplifying BOM and board area.
- Extensive I/O support: Up to 600 I/Os enable complex multi-interface designs without additional I/O expanders.
- Compact, production-ready package: 1152-ball FCBGA (35×35) surface-mount package allows dense PCB routing and standardized assembly processes.
- Clear electrical documentation: The Stratix V device datasheet provides detailed electrical and switching specifications to support design validation and system-level power planning.
- Commercial temperature qualification: Rated for 0 °C to 85 °C to match typical commercial product deployment requirements.
- RoHS compliant: Meets environmental regulatory requirements for commercial electronics.
Why Choose 5SGXMA3H2F35C2LG?
The 5SGXMA3H2F35C2LG positions itself as a high-capacity Stratix V GX FPGA for designs that require a combination of large logic resources, substantial embedded memory, and extensive I/O. Its FCBGA packaging and surface-mount form factor facilitate integration into compact, production PCBs while the documented electrical and switching characteristics support rigorous system design and validation.
This device is suited to engineering teams building complex data-paths, interface-intensive modules, and advanced processing functions who need a commercially graded, RoHS-compliant FPGA with clearly specified power and thermal operating bounds.
If you would like pricing, lead-time, or a formal quote for the 5SGXMA3H2F35C2LG, please submit a request for a quote or pricing inquiry and our team will respond with available options and ordering information.

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