5SGXMA3H2F35C2WN

The 5SGXMA3H2F35C2WN is a commercial-grade Stratix® V GX field programmable gate array offering high logic density and extensive I/O capability. It provides a large number of logic element cells and embedded RAM to support complex, high-capacity programmable designs.

As part of the Stratix V GX family, the device is specified with detailed electrical and switching characteristics in the device datasheet, including operating conditions and transceiver information for the Stratix V series.

Key Features

• Logic Capacity  Offers 340,000 logic element cells and 128,300 CLBs to accommodate large, compute-intensive designs.
• Embedded Memory  Approximately 19.46 Mbits of on-chip RAM for buffering, FIFOs, and memory-intensive functions.
• I/O  Up to 600 I/O pins for broad system connectivity and flexible board-level interfacing.
• Power  Core voltage supply specified from 870 mV to 930 mV to match platform power requirements.
• Package and Mounting  1152-BBGA (FCBGA) package; supplier device package listed as 1152-FBGA (35×35). Surface-mount device for standard PCB assembly.
• Operating Range  Commercial temperature grade rated for 0 °C to 85 °C.
• Regulatory  RoHS compliant.

Typical Applications

• High-density programmable logic  Use the device where large logic capacity and abundant on-chip RAM are required for complex FPGA implementations.
• High I/O systems  Deploy in designs that need extensive board-level connectivity and large pin counts.
• Memory-intensive processing  Leverage approximately 19.46 Mbits of embedded RAM for buffering, packet queues, and data staging within the FPGA fabric.

Unique Advantages

• Substantial logic resources: 340,000 logic element cells and 128,300 CLBs provide headroom for large designs and advanced feature integration.
• Significant on-chip RAM: Approximately 19.46 Mbits of embedded memory reduces dependence on external memory for many applications.
• High I/O count: 600 I/O pins simplify system partitioning and enable rich interfacing options without extensive external glue logic.
• Compact system footprint: 1152-BBGA (35×35) packaging allows high-density board layouts while maintaining surface-mount assembly compatibility.
• Commercial-grade operating range: Rated for 0 °C to 85 °C for designs targeting commercial-temperature environments.
• Standards-compliant sourcing: RoHS compliance supports environmentally conscious manufacturing and procurement requirements.

Why Choose 5SGXMA3H2F35C2WN?

This Stratix V GX device balances very large programmable logic capacity, substantial embedded RAM, and a high pin count in a 1152-BBGA package—making it a strong option for designs that require dense FPGA logic and extensive I/O in a commercial-temperature platform. The device’s documented electrical and switching characteristics for the Stratix V family provide the technical detail needed to assess power, timing, and I/O behavior during design.

Choose the 5SGXMA3H2F35C2WN when your project requires integrated memory, high logic density, and a high number of I/Os while operating within commercial temperature and core voltage ranges. Its specifications support scalable, feature-rich implementations with clear data-sheet-backed parameters for design and validation.

Request a quote or submit an inquiry for pricing and availability to begin evaluating the 5SGXMA3H2F35C2WN for your next high-density FPGA design.