5SGXMA3H2F35C2N

The 5SGXMA3H2F35C2N is a Stratix V GX family field programmable gate array (FPGA) delivered in a high-density FCBGA package. It provides a large array of logic resources, embedded memory, and high I/O count for commercial-grade programmable logic applications.

This device is specified for commercial temperature operation and documented electrical and switching characteristics are available in the Stratix V device datasheet, including transceiver and I/O timing information for designs that require detailed signal-performance planning.

Key Features

• Logic Capacity  Provides 340,000 logic elements for complex programmable logic and system integration.
• Embedded Memory  Includes approximately 19.456 Mbits of on-chip RAM for buffering, lookup tables, and state storage.
• I/O Density  Offers 600 programmable I/O pins to support high-pin-count interfaces and board-level integration.
• Package  Supplied in a 1152-BBGA, FCBGA package; supplier device package specified as 1152-FBGA (35x35).
• Power  Core voltage supply range specified from 870 mV to 930 mV for core power planning and regulation design.
• Temperature Grade  Commercial grade rated for 0 °C to 85 °C operation.
• Mounting and Compliance  Surface-mount device and RoHS compliant.

Typical Applications

• High-density logic implementations  Targets designs that require up to 340,000 logic elements and substantial on-chip RAM for complex algorithms and state machines.
• Signal processing and buffering  Approximately 19.456 Mbits of embedded memory supports on-device data buffering, FIFOs, and LUT-based functions.
• High I/O interface systems  600 I/O pins accommodate multi-channel I/O, protocol bridging, and dense board-level connectivity.

Unique Advantages

• High logic density:  340,000 logic elements enable integration of large logic designs into a single FPGA, reducing external component count.
• Substantial on-chip memory:  Approximately 19.456 Mbits of embedded RAM allows significant in-FPGA data storage and reduces reliance on external memory for many functions.
• Large I/O complement:  600 I/O pins support complex interfacing requirements and flexible system partitioning.
• Compact FCBGA package:  1152-BBGA / 1152-FBGA (35x35) packaging delivers a high-pin-count solution in a board-friendly surface-mount form factor.
• Documented electrical and switching characteristics:  Stratix V device datasheet provides detailed information for power, I/O timing, and transceiver behavior to support rigorous design validation.
• RoHS compliant:  Manufactured to meet RoHS requirements for environmentally constrained designs.

Why Choose 5SGXMA3H2F35C2N?

The 5SGXMA3H2F35C2N positions itself as a high-density, commercial-grade Stratix V GX FPGA option for designers who need a large logic fabric, significant embedded memory, and a high I/O count in a compact FCBGA package. Its defined core voltage range and documented operating temperature simplify power and thermal planning for commercial applications.

This device is suited to teams implementing complex programmable logic where consolidated logic capacity and on-chip RAM reduce BOM complexity and board-level integration effort, while the datasheet-backed electrical and switching details support thorough performance validation.

Request a quote or submit a procurement inquiry to obtain pricing, availability, and lead-time information for the 5SGXMA3H2F35C2N.