5SGXMA3H2F35C1WN

IC FPGA 600 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 19456000 340000 1152-BBGA, FCBGA

Quantity 641 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O600Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs128300Number of Logic Elements/Cells340000
Number of GatesN/AECCNOBSOLETEHTS CodeN/A
QualificationN/ATotal RAM Bits19456000

Overview of 5SGXMA3H2F35C1WN – Stratix® V GX FPGA, 1152-FBGA (35×35)

The 5SGXMA3H2F35C1WN is an Intel Stratix® V GX field-programmable gate array (FPGA) supplied in a 1152-FBGA (35×35) surface-mount package and offered in a commercial temperature grade. It integrates a large programmable fabric with 340,000 logic elements and approximately 19.456 Mbits of on-chip RAM to address high-density logic and memory requirements.

With 600 user I/Os, low-voltage core operation (870 mV to 930 mV), and Stratix V GX transceiver capabilities described in the device family datasheet, this device targets applications requiring dense logic integration, substantial embedded memory, and extensive I/O connectivity within a compact FBGA footprint.

Key Features

  • FPGA Core  Stratix V GX architecture with 340,000 logic elements for complex, parallelizable designs.
  • Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support large buffering, lookup tables, and state storage.
  • High-density I/O  600 user I/Os providing broad external interfacing capability for multi-protocol and multi-channel designs.
  • Transceiver Capability (device-family)  Stratix V GX devices include GX transceiver speed grades described in the datasheet, with supported channel performance options up to the GX grade defined in the device documentation.
  • Power and Core Voltage  Core voltage supply range of 870 mV to 930 mV for defined operating conditions.
  • Package and Mounting  1152-FBGA (35×35) package, surface-mount, optimized for high-density board integration.
  • Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C for commercial applications.
  • RoHS Compliant  Device complies with RoHS environmental requirements.

Typical Applications

  • High-performance networking  Use the programmable fabric and extensive I/O to implement packet processing, switching logic, and custom forwarding engines.
  • Data center acceleration  Deploy dense logic and embedded memory for hardware-accelerated functions such as compression, encryption, or custom offload tasks.
  • High-speed serial systems  Leverage Stratix V GX transceiver capabilities (per device-family documentation) and the large I/O count for multi-channel serial links and protocol bridging.
  • Prototyping and system integration  Integrate complex system logic and memory-intensive functions in a single compact FBGA package for board-level validation and development.

Unique Advantages

  • Highly integrated programmable fabric: 340,000 logic elements enable consolidation of multiple functions into a single device, reducing board-level component count.
  • Substantial embedded memory: Approximately 19.456 Mbits of on-chip RAM supports large buffers and state machines without relying solely on external memory.
  • Broad external interfacing: 600 I/Os provide flexibility for connecting to a wide range of peripherals, PHYs, and daughtercards.
  • Compact, manufacturable package: 1152-FBGA (35×35) surface-mount package minimizes PCB area while supporting high-density routing.
  • Commercial operating range and RoHS compliance: Rated for 0 °C to 85 °C and RoHS-compliant for mainstream commercial deployments.
  • Defined core power envelope: Operates within a specified core voltage range (870 mV–930 mV) to support predictable power provisioning and system design.

Why Choose 5SGXMA3H2F35C1WN?

This Stratix V GX FPGA part brings together a large programmable logic capacity, substantial embedded memory, and extensive I/O in a compact 1152-FBGA package for commercial designs that demand dense integration and flexible interfacing. Its defined core voltage range and commercial temperature rating make it suitable for high-performance system designs where verified device-family transceiver options and on-chip resources are required.

Designers and system architects looking to consolidate functionality, accelerate compute-intensive tasks, or implement multi-channel interfaces will find the 5SGXMA3H2F35C1WN well matched to projects that prioritize logic capacity, embedded memory, and high I/O density within a surface-mount FBGA footprint.

Request a quote or submit your requirements to receive pricing and availability for the 5SGXMA3H2F35C1WN Stratix® V GX FPGA.

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