5SGXMA3H2F35C1WN
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 19456000 340000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 641 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 600 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 128300 | Number of Logic Elements/Cells | 340000 | ||
| Number of Gates | N/A | ECCN | OBSOLETE | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 19456000 |
Overview of 5SGXMA3H2F35C1WN – Stratix® V GX FPGA, 1152-FBGA (35×35)
The 5SGXMA3H2F35C1WN is an Intel Stratix® V GX field-programmable gate array (FPGA) supplied in a 1152-FBGA (35×35) surface-mount package and offered in a commercial temperature grade. It integrates a large programmable fabric with 340,000 logic elements and approximately 19.456 Mbits of on-chip RAM to address high-density logic and memory requirements.
With 600 user I/Os, low-voltage core operation (870 mV to 930 mV), and Stratix V GX transceiver capabilities described in the device family datasheet, this device targets applications requiring dense logic integration, substantial embedded memory, and extensive I/O connectivity within a compact FBGA footprint.
Key Features
- FPGA Core Stratix V GX architecture with 340,000 logic elements for complex, parallelizable designs.
- Embedded Memory Approximately 19.456 Mbits of on-chip RAM to support large buffering, lookup tables, and state storage.
- High-density I/O 600 user I/Os providing broad external interfacing capability for multi-protocol and multi-channel designs.
- Transceiver Capability (device-family) Stratix V GX devices include GX transceiver speed grades described in the datasheet, with supported channel performance options up to the GX grade defined in the device documentation.
- Power and Core Voltage Core voltage supply range of 870 mV to 930 mV for defined operating conditions.
- Package and Mounting 1152-FBGA (35×35) package, surface-mount, optimized for high-density board integration.
- Commercial Temperature Grade Rated for operation from 0 °C to 85 °C for commercial applications.
- RoHS Compliant Device complies with RoHS environmental requirements.
Typical Applications
- High-performance networking Use the programmable fabric and extensive I/O to implement packet processing, switching logic, and custom forwarding engines.
- Data center acceleration Deploy dense logic and embedded memory for hardware-accelerated functions such as compression, encryption, or custom offload tasks.
- High-speed serial systems Leverage Stratix V GX transceiver capabilities (per device-family documentation) and the large I/O count for multi-channel serial links and protocol bridging.
- Prototyping and system integration Integrate complex system logic and memory-intensive functions in a single compact FBGA package for board-level validation and development.
Unique Advantages
- Highly integrated programmable fabric: 340,000 logic elements enable consolidation of multiple functions into a single device, reducing board-level component count.
- Substantial embedded memory: Approximately 19.456 Mbits of on-chip RAM supports large buffers and state machines without relying solely on external memory.
- Broad external interfacing: 600 I/Os provide flexibility for connecting to a wide range of peripherals, PHYs, and daughtercards.
- Compact, manufacturable package: 1152-FBGA (35×35) surface-mount package minimizes PCB area while supporting high-density routing.
- Commercial operating range and RoHS compliance: Rated for 0 °C to 85 °C and RoHS-compliant for mainstream commercial deployments.
- Defined core power envelope: Operates within a specified core voltage range (870 mV–930 mV) to support predictable power provisioning and system design.
Why Choose 5SGXMA3H2F35C1WN?
This Stratix V GX FPGA part brings together a large programmable logic capacity, substantial embedded memory, and extensive I/O in a compact 1152-FBGA package for commercial designs that demand dense integration and flexible interfacing. Its defined core voltage range and commercial temperature rating make it suitable for high-performance system designs where verified device-family transceiver options and on-chip resources are required.
Designers and system architects looking to consolidate functionality, accelerate compute-intensive tasks, or implement multi-channel interfaces will find the 5SGXMA3H2F35C1WN well matched to projects that prioritize logic capacity, embedded memory, and high I/O density within a surface-mount FBGA footprint.
Request a quote or submit your requirements to receive pricing and availability for the 5SGXMA3H2F35C1WN Stratix® V GX FPGA.

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