5SGXMA3H1F35I2WN

The 5SGXMA3H1F35I2WN is an Intel Stratix® V GX field programmable gate array (FPGA) offered in an industrial temperature grade. It combines high logic density and on-chip memory with a large I/O count to support complex, high‑capacity digital designs.

Key hardware characteristics include 340,000 logic elements, approximately 19.456 Mbits of embedded memory, 600 I/Os, and a 1152‑ball FCBGA package (35 × 35 mm). The device is specified for a core supply range of 870 mV to 930 mV and an operating temperature range of −40 °C to 100 °C.

Key Features

• Core Logic  340,000 logic elements provide the fabric capacity required for large, multi‑function designs.
• Embedded Memory  Approximately 19.456 Mbits of on‑chip RAM for buffering, FIFOs, and local data storage.
• I/O Capacity & Packaging  600 user I/Os in a 1152‑BBGA (1152‑FBGA, 35 × 35 mm) FCBGA package to support dense board-level connectivity.
• Power and Voltage  Core supply specified from 870 mV to 930 mV for defined power domain planning and regulator selection.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for deployment in temperature‑sensitive environments.
• Compliance  RoHS compliant.

Typical Applications

• High‑density digital processing  Use the high logic element count and large embedded memory for compute‑intensive signal processing and algorithm acceleration.
• Networking and communications  Large I/O count and Stratix V GX family capabilities support complex protocol handling and multi‑lane interfaces.
• Industrial control and automation  Industrial temperature rating and broad I/O make the device suitable for rugged control systems and instrumentation.
• Prototype and system integration  High fabric capacity and on‑chip RAM enable development of feature‑rich prototypes and integration of multiple IP blocks.

Unique Advantages

• High logic capacity:  340,000 logic elements allow consolidation of functions and reduce the need for multiple devices.
• Substantial on‑chip memory:  Approximately 19.456 Mbits of embedded RAM supports large buffering and local data operations without external memory.
• Extensive I/O in a compact package:  600 I/Os in a 35 × 35 mm FCBGA package simplifies board routing while providing abundant connectivity.
• Industrial thermal range:  −40 °C to 100 °C rating makes the FPGA suitable for demanding environmental conditions.
• Defined core voltage window:  870–930 mV specification supports precise power planning for consistent device operation.
• RoHS compliant:  Meets regulatory requirements for lead‑free assembly.

Why Choose 5SGXMA3H1F35I2WN?

The 5SGXMA3H1F35I2WN offers a combination of high logic density, significant embedded memory, and broad I/O in a robust industrial‑grade Stratix V GX package. These attributes make it well suited to complex designs that require high integration, large on‑chip storage, and reliable operation across a wide temperature range.

Engineers designing advanced communications, signal processing, and industrial systems can leverage this Intel Stratix V GX device to consolidate functionality, manage board complexity, and maintain predictable electrical and thermal behavior thanks to the specified voltage and temperature operating ranges.

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