5SGXMA3H2F35C2G

The 5SGXMA3H2F35C2G is a Stratix® V GX Field Programmable Gate Array (FPGA) IC manufactured by Intel. It provides large on‑chip logic capacity and embedded memory within a 1152‑ball FCBGA package for surface‑mount assembly.

This device is specified for commercial operation with a core supply range of 870 mV to 930 mV and an operating temperature range of 0 °C to 85 °C, making it suitable for designs that require high logic density, substantial I/O, and significant embedded RAM capacity.

Key Features

• Core logic capacity — 340,000 logic elements (cells) delivering large programmable logic resources for complex designs.
• Logic array blocks — Approximately 128,300 logic array blocks for structured logic partitioning and routing.
• Embedded memory — Approximately 19.456 Mbits of on‑chip RAM to support buffering, FIFOs, and memory‑intensive functions.
• I/O density — 600 user I/Os to accommodate wide buses, multiple interfaces, and high‑pin‑count connectivity.
• Package and mounting — 1152‑BBGA (FCBGA) supplier package (1152‑FBGA, 35×35 mm) optimized for high‑density board layouts; surface mount device.
• Power and voltage — Core voltage supply range of 870 mV to 930 mV for device core operation.
• Temperature and grade — Commercial grade device specified for 0 °C to 85 °C operation.
• RoHS compliant — Environmentally compliant manufacturing status.

Unique Advantages

• High programmable capacity: 340,000 logic elements provide a substantial resource pool to implement complex digital functions on a single device, reducing system partitioning.
• Large embedded RAM: Approximately 19.456 Mbits of on‑chip memory supports data buffering, packet processing, and local storage without immediate external memory dependency.
• Extensive I/O availability: 600 I/Os enable broad peripheral connectivity and support for multiple parallel interfaces or wide data buses.
• Compact, high‑density package: 1152‑BBGA (35×35 mm) package allows high connection density in a compact surface‑mount form factor for space‑constrained PCBs.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation to match mainstream commercial product requirements.
• Regulatory readiness: RoHS compliance supports use in assemblies that require lead‑free compliant components.

Why Choose 5SGXMA3H2F35C2G?

The 5SGXMA3H2F35C2G positions itself as a high‑density Stratix V GX FPGA option from Intel, combining a large logic element count, substantial embedded memory, and high I/O count in a 1152‑ball FCBGA package. Its commercial temperature rating and RoHS compliance make it suitable for demanding commercial electronics requiring significant programmable logic and on‑chip resources.

This device is a fit for engineering teams targeting consolidated FPGA implementations that benefit from integrated RAM and high I/O capacity while maintaining a compact package footprint and surface‑mount compatibility. The specific electrical and switching characteristics are documented in the Stratix V device datasheet for detailed design and validation.

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