5SGXMA3H2F35C3N

The 5SGXMA3H2F35C3N is a Stratix® V GX field programmable gate array (FPGA) in a 1152-BBGA FCBGA package. It provides a high-density programmable fabric with 340,000 logic elements and extensive on-chip memory for complex digital designs.

Designed for applications that require large logic capacity, high I/O counts and substantial embedded RAM, this commercial-grade device offers a combination of integration and performance-ready electrical characteristics such as a core supply range of 820 mV–880 mV and an operating temperature range of 0 °C–85 °C.

Key Features

• Logic Capacity  340,000 logic elements to support large-scale digital designs and complex processing pipelines.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to store data and implement packet buffers, FIFOs, or lookup tables.
• I/O Density  600 user I/Os for wide external interfacing and high-pin-count system designs.
• Package & Mounting  1152-BBGA (FCBGA), supplier package 1152-FBGA (35×35), surface-mount mounting for compact board-level integration.
• Power  Core supply voltage specified at 820 mV to 880 mV for precise power provisioning and design planning.
• Operating Grade & Temperature  Commercial grade device rated for 0 °C to 85 °C operation.
• Compliance  RoHS compliant to meet common environmental directive requirements.
• Stratix V Series Characteristics (series-level)  Part of the Stratix V GX family; Stratix V devices are offered across multiple core and transceiver speed grades (series-level information).

Typical Applications

• High-density digital processing  Use the large logic element count and embedded RAM for compute-heavy processing pipelines and custom accelerators.
• Networking & Packet Processing  High I/O count and substantial on-chip memory make the device suitable for systems that handle multiple data streams and buffering.
• Prototyping & System Integration  High logic capacity and a compact FCBGA package support advanced prototype systems and integration into space-constrained boards.

Unique Advantages

• High logic density: 340,000 logic elements provide the headroom needed for complex state machines, custom datapaths, and hardware acceleration.
• Significant on-chip RAM: Approximately 19.456 Mbits of embedded memory reduces dependency on external RAM for many buffering and temporary storage needs.
• Extensive external interfacing: 600 I/Os enable flexible connectivity to peripherals, transceivers, and multi-lane interfaces.
• Compact packaging: 1152-BBGA (1152-FBGA 35×35) surface-mount package balances pin count and board footprint for dense system designs.
• Commercial-grade readiness: Rated for 0 °C–85 °C operation for standard commercial deployments.
• Standards-aware supply: RoHS compliance supports environmentally regulated product requirements.

Why Choose 5SGXMA3H2F35C3N?

The 5SGXMA3H2F35C3N positions itself as a high-capacity, commercially graded Stratix V GX FPGA for designs that demand large programmable logic resources, substantial embedded memory, and a high number of I/Os in a compact BGA package. Its defined core voltage range and operating temperature make it straightforward to integrate into power- and thermal-planned systems.

This device is suitable for engineers and teams building complex digital systems, network and data-processing hardware, or advanced prototypes that require scalable logic and on-chip storage while maintaining a compact board footprint and RoHS compliance.

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