5SGXMA3H2F35I2LG

The 5SGXMA3H2F35I2LG is a Stratix® V GX Field Programmable Gate Array (FPGA) optimized for high-density, industrial-grade designs. It provides a large configurable logic fabric, substantial on-chip memory, and a high I/O count in a compact 1152‑BBGA surface-mount package.

This device targets complex programmable-logic applications that require significant logic capacity, on-chip RAM, and extensive system connectivity, while operating across an industrial temperature range and a defined core voltage window.

Key Features

• Logic Capacity  340,000 logic elements for large, complex programmable-logic implementations.
• Embedded Memory  Approximately 19.5 Mbits of on-chip RAM to support buffering, data processing, and state storage.
• I/O Resources  600 I/O pins to enable broad external interfacing and system integration.
• Package and Mounting  1152‑BBGA package (supplier package: 1152‑FBGA, 35×35) in a surface-mount FCBGA form factor for high pin-count board designs.
• Power  Core supply range from 820 mV to 880 mV to support precise power delivery planning.
• Temperature and Grade  Industrial grade operation with an operating temperature range of –40°C to 100°C for deployment in demanding environments.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-density programmable logic systems  Leverage 340,000 logic elements and substantial on-chip RAM to implement complex datapaths, custom accelerators, and parallel processing pipelines.
• Signal processing and buffering  Embedded memory supports real-time buffering and intermediate storage for DSP and streaming workloads.
• Multi‑interface system integration  A 600‑pin I/O interface enables protocol bridging, aggregation, and extensive peripheral connectivity without excessive external logic.
• Industrial control and instrumentation  Industrial-grade temperature rating and robust packaging support deployment in factory, test, and automation equipment.

Unique Advantages

• High logic density: 340,000 logic elements enable consolidation of complex functions into a single device, reducing overall system component count.
• Large on-chip memory: Approximately 19.5 Mbits of embedded RAM minimizes dependence on external memory for many buffering and state-storage needs.
• Extensive I/O: 600 I/Os provide flexibility for connecting sensors, transceivers, peripherals, and other system interfaces.
• Industrial readiness: Rated for –40°C to 100°C operation and specified as industrial grade for demanding environments.
• Compact, high‑pin-count package: 1152‑BBGA (35×35) surface-mount FCBGA delivers dense connectivity in a board-friendly footprint.
• Defined core-power profile: Core voltage range of 820 mV to 880 mV helps designers specify power delivery and thermal management precisely.

Why Choose 5SGXMA3H2F35I2LG?

The 5SGXMA3H2F35I2LG delivers a combination of sizable programmable logic, significant embedded memory, and a large I/O complement in an industrial-grade Stratix V GX device. Its specifications make it suitable for designs that require high integration density, substantial on-chip resources, and reliable operation across a wide temperature range.

Engineers designing complex FPGA-based systems will find this part appropriate for consolidating functions, reducing external components, and planning precise power and thermal strategies—all supported by Stratix V family documentation and electrical characteristic guidance.

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