5SGXMA3H2F35I2WN

The 5SGXMA3H2F35I2WN is a Stratix® V GX family FPGA in an industrial-grade, surface-mount FCBGA package. It provides very high logic density and substantial on-chip memory for designs that require large-scale programmable logic and embedded storage.

With 340,000 logic elements, approximately 19.456 Mbits of embedded memory, and up to 600 I/O pins in a 1152-BBGA package, this device targets high-density programmable designs that need strong integration, industrial temperature operation, and tight supply voltage control.

Key Features

• Core Logic  340,000 logic elements suitable for complex digital implementations and large-scale designs.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM for buffering, look-up tables, and data storage within the fabric.
• I/O Capacity  Up to 600 user I/O pins to support wide parallel interfaces, high pin-count systems, and multiple peripherals.
• Package and Mounting  1152-BBGA (FCBGA) surface-mount package, supplier device package listed as 1152-FBGA (35×35), for board-level integration in space-constrained designs.
• Power and Supply  Core voltage range specified from 870 mV to 930 mV; suitable for designs requiring narrow, controlled core supply rails.
• Industrial Operating Range  Rated for industrial temperatures from −40°C to 100°C and qualified as an industrial grade part.
• Compliance  RoHS-compliant to support regulatory and environmental requirements.

Typical Applications

• High-density digital processing  Implement large-scale combinational and sequential logic where extensive logic elements and embedded memory are required.
• High-speed communications and networking  Use the Stratix V GX family’s transceiver capabilities and abundant I/O to build serial links, backplane interfaces, and packet-processing engines.
• Industrial control and automation  Leverage industrial temperature rating and robust I/O count for factory automation, motion control, and instrumentation systems.
• Prototyping and system consolidation  Consolidate multiple discrete functions into a single programmable device to reduce bill-of-materials and simplify board design.

Unique Advantages

• High logic density: 340,000 logic elements enable implementation of complex algorithms, large state machines, and extensive datapaths on a single device.
• Substantial embedded memory: Approximately 19.456 Mbits of RAM reduces the need for external memory in many buffering and storage applications.
• Large I/O complement: 600 I/O pins support broad interface options and parallel connectivity without external multiplexing.
• Industrial-temperature reliability: Rated from −40°C to 100°C for deployment in demanding thermal environments.
• Compact system package: 1152-BBGA FCBGA package delivers high pin-count in a compact board footprint for dense system designs.
• Regulatory alignment: RoHS compliance helps meet environmental and manufacturing requirements.

Why Choose 5SGXMA3H2F35I2WN?

The 5SGXMA3H2F35I2WN positions itself as a high-density, industrial-grade Stratix V GX FPGA offering significant logic and memory resources alongside a large I/O complement. It is suited for engineers and teams developing complex digital systems that demand integration, deterministic supply requirements, and operation across industrial temperatures.

For designs that require scalability and robustness, this FPGA delivers a balance of programmable capacity, on-chip memory, and I/O flexibility while conforming to RoHS requirements—making it a practical choice for industrial, communications, and high-performance embedded applications.

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