5SGXMA3H2F35I3LG

The 5SGXMA3H2F35I3LG is an Intel Stratix® V GX field‑programmable gate array (FPGA) offered in an industrial temperature grade. It integrates a high logic capacity with abundant embedded RAM and a large I/O complement, making it suitable for dense, I/O‑intensive digital designs.

This surface‑mount FCBGA package delivers integration for applications that require significant on‑chip logic, memory, and system I/O while operating over a wide industrial temperature range and a low core voltage domain.

Key Features

• High Logic Capacity  Approximately 340,000 logic elements to implement complex digital functions and large finite‑state machines.
• Embedded Memory  Approximately 19.5 Mbits of on‑chip RAM for buffering, frame storage, and algorithmic data processing.
• Large I/O Count  600 I/O pins to support dense external interfacing, parallel buses, and multi‑lane connectivity.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for deployment in thermally demanding environments.
• Low‑Voltage Core  Core supply domain specified between 820 mV and 880 mV for designs targeting low‑voltage power domains.
• Package and Mounting  1152‑ball BGA / FCBGA (supplier package 1152‑FBGA, 35×35) in a surface‑mount form factor for dense PCB layouts and automated assembly.
• RoHS Compliant  Meets RoHS environmental requirements.

Typical Applications

• High‑density digital signal processing  Use the large logic and on‑chip RAM capacity to implement DSP pipelines, filtering, and real‑time data processing.
• Complex system control  Deploy the device for multi‑function control systems that require many I/Os and substantial logic resources.
• Communication and protocol bridging  Leverage the 600 I/O pins and substantial logic fabric to integrate protocol conversion, packet processing, and interface aggregation.
• Industrial embedded platforms  Industrial temperature rating and surface‑mount BGA packaging support robust embedded deployments.

Unique Advantages

• Large on‑chip resources:  Combines approximately 340,000 logic elements with ~19.5 Mbits of embedded RAM to reduce reliance on external memory and discrete logic.
• Extensive external connectivity:  600 I/O pins enable complex peripherals, wide parallel buses, and multi‑lane external interfaces without added glue logic.
• Industrial readiness:  −40 °C to 100 °C operating range supports applications in harsh or variable thermal environments.
• Compact, assembly‑friendly package:  1152‑ball BGA/FCBGA in a 35×35 supplier footprint supports high‑density board designs and automated surface‑mount assembly.
• Low core voltage operation:  820–880 mV supply domain helps designs targeting modern low‑voltage power architectures.
• Standards‑aligned compliance:  RoHS compliance addresses common environmental and regulatory requirements for electronic assemblies.

Why Choose 5SGXMA3H2F35I3LG?

The 5SGXMA3H2F35I3LG positions itself as a high‑capacity Stratix® V GX FPGA option for engineers who need a combination of substantial logic resources, sizable embedded memory, and a large I/O complement in an industrial‑rated package. Its low core voltage and dense BGA footprint make it suitable for compact, power‑aware system designs that still require extensive on‑chip functionality.

For teams developing industrial embedded systems, communication infrastructure elements, or advanced DSP platforms, this device offers the scalability and robustness to support complex designs while simplifying board‑level integration.

Request a quote or submit an inquiry to check availability and pricing for 5SGXMA3H2F35I3LG and to discuss how it can meet your project requirements.