5SGXMA3H2F35I3WN

The 5SGXMA3H2F35I3WN is a Stratix® V GX field-programmable gate array (FPGA) IC from Intel. It delivers very-high logic density and extensive I/O in a 1152-BBGA (35×35) FCBGA package, and is offered in an industrial temperature grade.

Key on-chip resources include approximately 340,000 logic elements and roughly 19.46 Mbits of embedded RAM, together with up to 600 user I/Os. These characteristics make the device well suited to designs that require large programmable logic capacity, significant embedded memory, and high I/O pin counts.

Key Features

• Core Logic  Approximately 340,000 logic elements provide a high-density programmable fabric for complex digital designs.
• Embedded Memory  Approximately 19.46 Mbits of on-chip RAM to support buffering, packet processing, and algorithm acceleration.
• I/O Capacity  Up to 600 user I/Os, enabling wide parallel interfaces and multiple peripheral connections.
• Package  1152-BBGA (FCBGA) supplier device package: 1152-FBGA (35×35) for surface-mount applications.
• Power and Supply  Specified core supply range: 820 mV to 880 mV.
• Temperature and Grade  Industrial-grade device rated for operation from –40°C to 100°C.
• Stratix V GX Family Attributes  As a Stratix V GX device, the family documentation covers transceiver, core, and periphery switching characteristics; Stratix V GX and GS family transceiver speed grades are defined in the device datasheet.

Typical Applications

• High-density digital processing  Designs needing large programmable logic capacity and substantial embedded RAM for complex algorithms and acceleration.
• I/O‑intensive interfaces  Systems that require many external connections or parallel interfaces, taking advantage of up to 600 user I/Os.
• Industrial systems  Deployments requiring industrial temperature operation (–40°C to 100°C) and surface-mount package integration.

Unique Advantages

• High logic density: Approximately 340,000 logic elements allow consolidation of large designs into a single FPGA, reducing board-level complexity.
• Significant on-chip memory: Roughly 19.46 Mbits of embedded RAM supports data buffering and state storage without external memory.
• Extensive I/O count: Up to 600 I/Os accommodate multiple parallel interfaces and high pin-count peripherals.
• Industrial temperature rating: Specified operation from –40°C to 100°C supports deployment in thermally demanding environments.
• FCBGA assembly: 1152-BBGA (35×35) package provides a compact, surface-mount form factor for dense board designs.
• Documented family characteristics: Backed by Stratix V device documentation that details electrical and switching characteristics for device-level design and validation.

Why Choose 5SGXMA3H2F35I3WN?

The 5SGXMA3H2F35I3WN combines very-high logic capacity, substantial embedded RAM, and a large I/O complement in an industrial-grade FCBGA package—making it suitable for demanding, space-constrained designs that require on-chip resources and robust temperature performance. Its specifications align with applications that need consolidated programmable logic, extensive memory, and broad external connectivity.

Design teams requiring detailed electrical and switching characteristics can reference the Stratix V family documentation for device-level guidance and validation data.

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