5SGXMA3H2F35I3N

The 5SGXMA3H2F35I3N is an industrial‑grade Stratix V GX FPGA offering a high density of programmable logic and on‑chip memory for demanding embedded and system applications. As a member of the Stratix V GX family, it targets designs requiring large logic capacity, extensive I/O, and industry temperature operation.

With 340,000 logic elements and approximately 19.456 Mbits of embedded RAM, this device is suited for high‑throughput signal processing, complex control logic, and multi‑interface system integration where performance, integration, and reliability across industrial temperatures matter.

Key Features

• Logic Capacity — 340,000 logic elements providing substantial programmable fabric for large, complex designs.
• Embedded Memory — Approximately 19.456 Mbits of on‑chip RAM to support buffering, lookup tables, and state storage without external memory.
• I/O Density — 600 user I/Os to enable dense connectivity and multiple parallel interfaces.
• Power and Core Voltage — Core supply range of 820 mV to 880 mV for defined operating conditions and power budgeting.
• Package & Mounting — 1152‑BBGA (FCBGA) 35×35 supplier device package, surface mount for standard board assembly.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C to meet industrial deployment environments.
• Compliance — RoHS compliant.
• Stratix V GX Family Characteristics — Part of the Stratix V GX device family covered in the datasheet series, which documents industrial/commercial speed grades and transceiver offerings for system designers.

Typical Applications

• High‑Performance Communications — Use the device for protocol handling, packet processing, and multi‑lane I/O aggregation where many I/Os and large logic resources are required.
• Data Path and Signal Processing — Large logic element count and on‑chip RAM enable FPGA‑based DSP, filtering, and custom data pipeline implementations.
• Industrial Control Systems — Industrial temperature rating and extensive I/O support robust control, motor drives, and real‑time machine automation tasks.
• Compute Acceleration — Implement hardware accelerators and custom compute kernels leveraging the device’s logic and embedded memory resources.

Unique Advantages

• High Logic Density: 340,000 logic elements let you integrate complex functions and reduce external components.
• Substantial On‑Chip Memory: Approximately 19.456 Mbits of embedded RAM supports deep buffering and stateful processing without immediate need for external DRAM.
• Extensive Connectivity: 600 I/Os enable multiple parallel interfaces and flexible board partitioning for complex system architectures.
• Industrial‑Grade Reliability: −40 °C to 100 °C operating range targets systems deployed in tough environments.
• Compact, Surface‑Mount Packaging: 1152‑BBGA (35×35) package offers a high‑pin‑count, board‑mount form factor suitable for compact system designs.
• Standards‑Oriented Family Support: As part of the Stratix V GX series, product design can align with family‑level documentation for speed grades and transceiver options.

Why Choose 5SGXMA3H2F35I3N?

This Stratix V GX FPGA balances very large programmable logic capacity, sizeable embedded memory, and a high pin count to support integration of complex algorithms and multi‑interface systems in a single device. The industrial temperature rating and RoHS compliance make it suitable for long‑lifecycle deployments where environmental robustness is required.

Design teams building high‑throughput communications, real‑time signal processing, or advanced control systems will find the 5SGXMA3H2F35I3N appropriate for reducing board-level complexity while delivering the programmable bandwidth and I/O flexibility needed for demanding applications.

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