5SGXMA3H2F35I2N

The 5SGXMA3H2F35I2N is a Stratix V GX FPGA packaged in a 1152-BBGA FCBGA (1152-FBGA, 35×35) surface-mount package from Intel. This industrial-grade device integrates a large logic fabric, substantial embedded RAM, and extensive I/O to address demanding designs that require high logic density and robust I/O capability.

Key electrical and environmental characteristics include a core supply range of 870 mV to 930 mV and an operating temperature range of −40 °C to 100 °C, with RoHS compliance for environmental compatibility.

Key Features

• High Logic Density — 340,000 logic elements (cells) provide substantial on-chip programmable logic capacity for complex designs.
• Embedded Memory — Approximately 19.456 Mbits of on-chip RAM to support large buffering, state storage, and memory-intensive logic functions.
• Extensive I/O — 600 I/O pins support dense interfacing and multiple external peripherals or parallel interfaces.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C to suit industrial environments and extended-temperature applications.
• Power and Supply — Core voltage supply specified between 870 mV and 930 mV for precise power design and regulation.
• Package and Mounting — 1152-BBGA, FCBGA package (supplier 1152-FBGA, 35×35) in a surface-mount form factor for high-density PCB integration.
• Family-Level Transceiver Options — As a Stratix V GX device, the family offers transceiver speed grade options per device datasheet for designs requiring high-speed serial I/O.
• Compliance — RoHS compliant.

Typical Applications

• Industrial Control and Automation — Industrial temperature rating and wide I/O count allow deployment in control systems, I/O aggregation, and real-time logic processing.
• High-Density Logic Implementation — Large logic element count and embedded memory make the device suitable for consolidating complex logic functions and accelerators on a single FPGA.
• Communications and Interface Hubs — High I/O availability and Stratix V GX family transceiver options support implementation of protocol bridging, interface conversion, and I/O-heavy communication endpoints.
• Prototyping and System Integration — Surface-mount 1152-FBGA packaging and extensive resources facilitate board-level integration and system prototyping where logic density and I/O are critical.

Unique Advantages

• Substantial On-Chip Resources: 340,000 logic elements paired with ~19.5 Mbits of RAM reduces dependence on external memory and simplifies board-level design.
• High I/O Count: 600 I/Os enable flexible interfacing options and support for multiple parallel ports or mixed-signal front ends.
• Industrial Reliability: Rated operation from −40 °C to 100 °C supports deployments in extended-temperature environments common to industrial applications.
• Compact, High-Density Package: 1152-BBGA (35×35) surface-mount package offers a compact footprint for high-density PCB designs.
• Controlled Core Supply Range: Defined 870 mV to 930 mV core voltage window simplifies power-supply selection and regulation design for stable operation.
• Standards-Based Family Support: As part of the Stratix V GX family, the device benefits from documented family-level transceiver options and device electrical characteristics in the vendor datasheet.

Why Choose 5SGXMA3H2F35I2N?

The 5SGXMA3H2F35I2N combines a large logic element count, significant embedded memory, and a high I/O complement in an industrial-grade, surface-mount FBGA package. These characteristics make it well suited for designs that require dense programmable logic, ample on-chip RAM, and extensive interfacing while operating across an extended temperature range.

Customers targeting high-density, I/O-centric systems will find this Stratix V GX device appropriate for consolidating complex logic and memory needs on a single FPGA platform while leveraging documented family-level electrical and transceiver characteristics for system design.

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