5SGXMA3E3H29I4N

The 5SGXMA3E3H29I4N is a Stratix V GX field programmable gate array (FPGA) IC designed for high‑density, industrial‑grade applications. It delivers 340,000 logic elements and approximately 19.456 Mbits of embedded RAM in a 780‑BBGA FCBGA package with up to 600 user I/O pins.

Targeted at designs that require substantial on‑chip logic and memory capacity with industrial temperature capability, this device supports surface‑mount assembly and a core voltage supply range of 820 mV to 880 mV.

Key Features

• High‑density core — 340,000 logic elements provide large programmable fabric for complex digital designs.
• Embedded memory — Total RAM bits: 19,456,000, or approximately 19.456 Mbits of on‑chip memory for buffering and data storage.
• Extensive I/O — Up to 600 I/O pins to accommodate wide parallel interfaces and multiple peripheral connections.
• Package and mounting — 780‑BBGA (FCBGA) package; supplier package listed as 780‑HBGA (33 × 33). Device is intended for surface‑mount assembly.
• Core supply range — Operates with a core voltage supply from 820 mV to 880 mV, matching low‑voltage core domains.
• Industrial rating and temperature range — Grade: Industrial; operating temperature range −40 °C to 100 °C for deployment in industrial environments.

Typical Applications

• High‑density digital processing — Large logic and embedded RAM capacity enable complex datapath and control implementations.
• Interface aggregation — High I/O count supports systems that consolidate multiple parallel and serial interfaces.
• Industrial automation — Industrial grade temperature range and package choices suit factory and process control equipment.
• Embedded system accelerators — On‑chip memory and logic resources allow implementation of accelerators and custom processing blocks.

Unique Advantages

• Substantial on‑chip resources: 340,000 logic elements and ~19.456 Mbits of RAM permit integration of large functions on a single device.
• High I/O density: 600 user I/O pins provide flexibility for complex board‑level connectivity without external multiplexing.
• Industrial readiness: Specified operating range from −40 °C to 100 °C supports deployment in demanding environments.
• Compact BGA packaging: 780‑BBGA (33 × 33 supplier package) enables high‑density PCB layouts while retaining robust mounting.
• Defined core supply window: 820 mV–880 mV core voltage support aligns with low‑voltage FPGA system designs.

Why Choose 5SGXMA3E3H29I4N?

This Stratix V GX FPGA part offers a balance of high logic density, substantial embedded memory, and a large I/O footprint in an industrial‑rated package. It is well suited for designers building complex digital systems, interface hubs, or embedded accelerators that require on‑chip capacity and robust thermal performance.

Choosing 5SGXMA3E3H29I4N provides a scalable hardware platform for demanding implementations where integration, I/O access, and industrial temperature operation are prioritized.

Request a quote or submit an inquiry today to discuss availability and to obtain pricing and lead‑time information for 5SGXMA3E3H29I4N.