5SGXMA3E3H29I3LN

The 5SGXMA3E3H29I3LN is a Stratix® V GX field-programmable gate array (FPGA) in a 780-BBGA (FCBGA) surface-mount package manufactured by Intel. It provides a high logic-resource device profile intended for industrial-grade embedded and system designs.

Designed for applications that require large programmable logic capacity and abundant on-chip memory and I/O, this device delivers 340,000 logic elements, approximately 19.456 Mbits of embedded RAM, and up to 600 I/O pins while operating across an industrial temperature range and a low-voltage core supply.

Key Features

• Core Logic  340,000 logic elements for large-scale programmable logic implementations.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support buffering, look-up tables, and state storage.
• I/O Density  600 I/O pins to accommodate extensive parallel interfaces and mixed-signal breakout requirements.
• Power / Core Voltage  Specified core supply range of 820 mV to 880 mV to guide power budgeting and regulator selection.
• Package & Mounting  780-BBGA (FCBGA) surface-mount package; supplier device package listed as 780-HBGA (33×33) for PCB footprint planning.
• Temperature & Grade  Industrial grade with an operating temperature range of –40°C to 100°C for deployment in demanding environments.
• Compliance  RoHS compliant.

Typical Applications

• Industrial Control & Automation  Industrial temperature rating and robust logic/memory resources make the device suitable for factory automation, motion control, and process control systems.
• High-density Signal Processing  Large logic capacity and substantial on-chip RAM support DSP, protocol processing, and real-time data path implementations.
• Complex Interface Aggregation  High I/O count enables aggregation and bridging of multiple parallel and serial interfaces for communication and instrumentation systems.
• Embedded System Integration  FCBGA surface-mount packaging and a compact 33×33 supplier package footprint suit board-level integration in space-constrained designs.

Unique Advantages

• Large on-chip logic capacity: 340,000 logic elements reduce the need for multi-device partitioning and simplify large-design implementation.
• Substantial embedded memory: Approximately 19.456 Mbits of RAM for data buffering, packet queues, and internal state storage without external memory dependence.
• Extensive I/O resources: 600 I/O pins provide flexibility to connect numerous sensors, transceivers, and peripherals directly to the FPGA fabric.
• Industrial thermal capability: Rated for –40°C to 100°C operation to support deployment in harsh or temperature-variable environments.
• Low-voltage core operation: 820–880 mV core supply window assists in designing efficient power supplies and thermal profiles.
• Compact BGA packaging: 780-BBGA (780-HBGA, 33×33) enables high-density board integration while maintaining a surface-mount assembly flow.

Why Choose 5SGXMA3E3H29I3LN?

The 5SGXMA3E3H29I3LN brings large-scale Stratix® V GX FPGA resources into an industrial-grade, surface-mount form factor. With 340,000 logic elements, approximately 19.456 Mbits of embedded RAM, and 600 I/O pins, it is suited to designs that need substantial on-chip capacity and a wide operating temperature window.

Manufactured by Intel and packaged in a 780-BBGA (33×33) footprint, this device is appropriate for engineers building high-density, board-integrated FPGA solutions where logic density, memory, I/O count, and industrial thermal range are primary selection criteria.

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