5SGXMA3E3H29I3G

The 5SGXMA3E3H29I3G is a Stratix® V GX Field Programmable Gate Array (FPGA) offered in a 780-ball BGA (FCBGA) package. It delivers large on-chip logic capacity, a high I/O count and substantial embedded memory in a surface-mount package rated for industrial temperature operation.

This device is suitable for designs that require significant logic resources, a broad array of I/O signals, and robust operating conditions—benefits derived directly from its specified logic element count, embedded RAM, I/O capacity, and industrial temperature grade.

Key Features

• Core Logic  Provides 340,000 logic elements for implementing complex digital functions and large-scale programmable logic.
• Embedded Memory  Approximately 19.46 Mbits of on-chip RAM to support buffering, FIFOs, and intermediate data storage within the FPGA fabric.
• I/O Capacity  600 user I/Os to connect with parallel buses, external peripherals, and board-level interfaces.
• Package & Mounting  780-ball BGA package (FCBGA) / Supplier device package: 780-HBGA (33×33); surface-mount mounting for standard PCB assembly processes.
• Power Supply  Core voltage supply range specified at 820 mV to 880 mV.
• Temperature & Grade  Industrial grade with an operating temperature range of −40°C to 100°C for deployment in thermally demanding environments.
• Standards & Compliance  RoHS compliant.
• Family Characteristics  Part of the Stratix V GX family; device-level documentation covers electrical, switching, and I/O timing characteristics for the family.

Typical Applications

• High-density logic designs  Systems that require hundreds of thousands of logic elements to implement complex FPGA-based algorithms and custom logic blocks.
• Large I/O interfacing  Board-level applications that need hundreds of user I/Os for parallel interfaces, multi-lane connectivity, or wide bus attachments.
• On-chip buffering and memory-intensive functions  Designs that leverage approximately 19.46 Mbits of embedded memory for FIFOs, lookup tables, and data buffering.

Unique Advantages

• Substantial programmable capacity: 340,000 logic elements provide the scale for complex, integrated functions without immediate external logic expansion.
• High I/O count: 600 I/Os reduce the need for external multiplexing or I/O expanders, simplifying board-level design.
• Significant on-chip RAM: Approximately 19.46 Mbits of embedded memory supports large data structures and high-throughput buffering inside the FPGA fabric.
• Industrial temperature rating: Operation from −40°C to 100°C supports deployment in temperature-challenging environments.
• Compact BGA packaging: 780-ball FCBGA (33×33) package balances a high pin count with a compact footprint for dense PCB layouts.
• Controlled core supply range: Defined core voltage window (820 mV–880 mV) enables predictable power design and supply planning.

Why Choose 5SGXMA3E3H29I3G?

The 5SGXMA3E3H29I3G positions itself as a high-capacity Stratix V GX FPGA option for designs that need a combination of extensive programmable logic, a large I/O complement, and meaningful on-chip memory while meeting industrial temperature requirements. Its 780-ball FCBGA package and surface-mount mounting keep the solution PCB-friendly for compact, high-density boards.

This device is appropriate for engineering teams and procurement seeking a verified Stratix V GX device with explicit electrical and operating specifications—offering scalability, clear power-supply requirements, and RoHS compliance for long-term design planning.

Request a quote or submit a product availability inquiry to obtain pricing, lead times, and ordering information for the 5SGXMA3E3H29I3G.