5SGXMA3E3H29I3L

The 5SGXMA3E3H29I3L is an industrial-grade Stratix® V GX field programmable gate array (FPGA) offering very high logic and memory capacity in a surface-mount FCBGA package. It targets designs that require large-scale programmable logic, abundant embedded memory, and a dense I/O complement.

As a member of the Stratix V GX family, the device is specified with industrial temperature grade and is documented in the Stratix V device datasheet for electrical and switching characteristics, including operating conditions and transceiver speed-grade options.

Key Features

• Large logic capacity — Provides 340,000 logic elements for complex, high-density logic implementations.
• Configurable logic blocks (CLBs) — 128,300 CLBs to structure gate-level and algorithmic designs efficiently.
• Embedded memory — Approximately 19.456 Mbits of on-chip RAM to support buffers, FIFOs, and local data storage.
• High I/O count — Up to 600 I/O pins for extensive peripheral and subsystem interfacing.
• Power envelope — Core voltage supply range of 820 mV to 880 mV for core power planning and regulator selection.
• Industrial temperature rating — Rated for operation from –40 °C to 100 °C to meet elevated ambient and industrial use cases.
• Package and mounting — Available in a 780‑ball BGA FCBGA (supplier package: 780‑HBGA, 33 × 33 mm) and supplied for surface-mount assembly.
• Regulatory compliance — RoHS compliant.

Typical Applications

• High-density digital processing — Large logic element and CLB counts enable implementation of wide datapaths, custom processors, and parallel compute engines.
• Memory-intensive buffering and packet processing — Approximately 19.456 Mbits of embedded RAM supports packet buffering, FIFOs, and other on-chip data structures.
• Multi‑interface gateway and aggregation — Up to 600 I/Os allow dense connectivity for bridging, protocol conversion, and system aggregation roles.

Unique Advantages

• Extensive programmable resources: 340,000 logic elements and 128,300 CLBs provide the headroom for large, complex designs without partitioning functionality across multiple devices.
• Significant on-chip memory: Approximately 19.456 Mbits of embedded RAM reduces external memory dependence and simplifies board-level designs.
• High I/O density: 600 I/Os enable direct interfacing to numerous peripherals and high-pin-count subsystems, lowering integration complexity.
• Industrial operating range: Specified for –40 °C to 100 °C operation to suit temperature-challenged environments.
• Surface-mount BGA packaging: 780-ball FCBGA (supplier: 780‑HBGA 33×33) supports compact, high-density PCB layouts.
• Standards-compliant supply chain: RoHS compliance supports environmentally responsible manufacturing and procurement.

Why Choose 5SGXMA3E3H29I3L?

The 5SGXMA3E3H29I3L balances very high logic and memory capacity with a large I/O complement and industrial temperature rating, making it suitable for demanding, high‑density programmable designs. Its package and electrical characteristics simplify board integration for applications that require substantial on-chip resources and robust environmental tolerance.

Designers and procurement teams seeking a Stratix V GX FPGA with extensive logic elements, abundant embedded RAM, and a high I/O count will find this device appropriate for scalable, long‑lifecycle systems where integration density and thermal range are key considerations.

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