5SGXMA3E3H29I3LG

The 5SGXMA3E3H29I3LG is a Stratix® V GX family FPGA from Intel, delivered in a 780-BBGA FCBGA package. It combines high logic capacity and embedded memory with a large I/O count, making it suitable for industrial-grade digital designs that require dense programmable logic and extensive interfacing.

Key device parameters include 340,000 logic elements, approximately 19.456 Mbits of embedded RAM, 600 user I/Os, a 780-HBGA (33×33) supplier package, an industrial operating temperature range of −40 °C to 100 °C, and a core supply window of 820 mV to 880 mV.

Key Features

• Core Capacity  340,000 logic elements provide substantial programmable logic for complex digital designs and high-density implementations.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM for buffering, FIFOs, and local data storage without external memory.
• I/O and Connectivity  600 user I/Os enable wide parallel interfaces and high-pin-count system integration for extensive peripheral and board-level connectivity.
• Transceiver Capability (Series)  Stratix V GX devices in this family support high-speed transceiver speed grades (series datasheet lists GX channel rates up to 14.1 Gbps), suitable for high-bandwidth serial links when implemented.
• Power  Core supply range of 820 mV to 880 mV allows precise power provisioning and supports designs optimized for core-voltage power domains.
• Package and Mounting  Surface-mount 780-BBGA (supplier package 780-HBGA, 33×33) provides a compact high-pin-count footprint for space-constrained PCBs.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C to meet industrial-environment requirements.
• Regulatory  RoHS compliant.

Typical Applications

• High-performance networking  Use the device for protocol processing, packet inspection, and line-rate interfaces where large logic capacity and high-speed serial connectivity are required.
• Signal processing and acceleration  Deploy the FPGA for DSP blocks, hardware accelerators, and pipeline engines that leverage abundant logic elements and on-chip memory.
• Industrial systems  Integrate into industrial control, automation, and instrumentation systems that benefit from the device’s industrial temperature range and high I/O count.
• High-density embedded platforms  Embed the FPGA in compact systems requiring many I/Os and dense programmable logic in a 33×33 HBGA footprint.

Unique Advantages

• High logic density: 340,000 logic elements allow consolidation of multiple functions and reduced external component count.
• Substantial on-chip RAM: Approximately 19.456 Mbits of embedded memory minimizes dependency on external RAM for buffering and local storage.
• Extensive I/O resources: 600 I/Os support rich peripheral integration and parallel data paths without complex board multiplexing.
• Industrial robustness: Rated for −40 °C to 100 °C operation to support demanding industrial environments.
• Compact, high-pin package: 780-BBGA FCBGA (780-HBGA supplier package, 33×33) enables high connectivity in a compact board area.
• Standards-conscious manufacturing: RoHS compliance supports regulatory and environmental requirements.

Why Choose 5SGXMA3E3H29I3LG?

The 5SGXMA3E3H29I3LG delivers a balance of large programmable logic capacity, significant embedded memory, and a high I/O count in a compact BGA package—positioning it for complex industrial and high-performance digital designs. Its industrial temperature rating and RoHS compliance make it suitable for long-life deployments in challenging environments.

Designers targeting integrated, high-density FPGA solutions will find this Stratix V GX device appropriate for systems that require scalable logic resources, substantial on-chip RAM, and extensive interfacing while operating within a defined core voltage window.

Request a quote or submit a product inquiry to get pricing and availability for the 5SGXMA3E3H29I3LG.