5SGXMA3E3H29I3N

The 5SGXMA3E3H29I3N is a Stratix V GX Field Programmable Gate Array (FPGA) IC from Intel, supplied in a 780‑BBGA FCBGA package. It provides a high-density programmable logic fabric with extensive I/O and embedded memory, designed for industrial temperature operation.

This device targets designs that require large logic capacity, substantial on‑chip RAM, and a high pin count in a surface‑mount BGA package. It is specified for a core supply voltage range of 820 mV to 880 mV and an operating temperature range of −40 °C to 100 °C.

Key Features

• Core logic capacity — 340,000 logic elements to implement complex, high‑density digital logic and custom compute pipelines.
• Logic clusters — 128,300 logic clusters (as provided in part specifications) for structured logic partitioning and routing.
• Embedded memory — Approximately 19.456 Mbits of on‑chip RAM for buffering, state storage, and memory‑based functions.
• I/O density — 600 user I/O pins to support wide external interfacing and parallel connectivity.
• Package — 780‑BBGA, FCBGA package (supplier device package: 780‑HBGA, 33 × 33 mm) optimized for high pin‑count, surface‑mount board designs.
• Power — Core supply voltage specified from 820 mV to 880 mV for device operation.
• Temperature and grade — Industrial grade device rated for operation from −40 °C to 100 °C.
• Mounting — Surface‑mount device suitable for standard PCB assembly processes.
• Regulatory — RoHS compliant.

Typical Applications

• High‑density logic implementations — Use where large amounts of programmable logic (340,000 logic elements) are required for custom digital functions.
• On‑chip memory‑centric designs — Suitable for designs leveraging approximately 19.456 Mbits of embedded RAM for buffering, FIFOs, or state machines.
• High‑pin‑count interfacing — Ideal for systems needing up to 600 I/Os to interface with multiple peripherals, parallel buses, or broad external I/O requirements.

Unique Advantages

• Large programmable fabric: 340,000 logic elements provide capacity for complex algorithms, custom accelerators, and extensive glue logic.
• Substantial on‑chip memory: Approximately 19.456 Mbits of RAM minimizes external memory dependence for many buffering and storage needs.
• Extensive I/O: 600 I/Os enable broad connectivity and flexible interfacing options in dense system designs.
• Industrial temperature range: Rated −40 °C to 100 °C to support deployment in industrial environments.
• High‑pin BGA package: 780‑BBGA (780‑HBGA supplier package, 33 × 33 mm) balances pin count and board‑level integration for complex PCBs.
• Low‑voltage core operation: Specified core supply of 820–880 mV for designs targeting low core voltages.

Why Choose 5SGXMA3E3H29I3N?

The 5SGXMA3E3H29I3N combines high logic density, significant embedded RAM capacity, and a large I/O count in a compact 780‑BBGA FCBGA package rated for industrial temperatures. These characteristics make it well suited for engineers building complex programmable systems that demand on‑chip resources and extensive external connectivity.

This device is positioned for designs that require scalability in logic and memory while maintaining a defined industrial operating range and a high‑pin‑count package for system integration. Its specification set supports robust, long‑lifetime deployments where programmable flexibility and board‑level integration are primary considerations.

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