5SGXMA3E3H29I3WN

The 5SGXMA3E3H29I3WN is a Stratix V GX Field Programmable Gate Array from Intel. This high-density FPGA integrates a large logic fabric, significant on-chip RAM, and a high I/O count in a 780-ball FCBGA package, targeting designs that require substantial programmable logic and high interfacing capacity.

With industrial-grade operation and a low-voltage core supply range, the device is suitable for applications that demand reliability across extended temperature ranges while leveraging a high number of logic elements and embedded memory.

Key Features

• Logic Capacity  Approximately 340,000 logic elements provide a large programmable fabric for complex logic and custom hardware acceleration.
• On‑Chip Memory  Approximately 19.456 Mbits of embedded memory for buffering, lookup tables, and data processing close to logic.
• I/O Density  600 dedicated I/O pins to support extensive peripheral connectivity and multi-channel interfacing.
• Package & Mounting  780-BBGA (FCBGA) package, supplier device package 780-HBGA (33×33), designed for surface-mount PCB assembly.
• Power Supply  Core voltage supply range of 820 mV to 880 mV, enabling defined low-voltage operation requirements.
• Temperature & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• Regulatory Compliance  RoHS compliant for environmental and manufacturing requirements.

Typical Applications

• High‑speed serial communications  Suitable for designs that implement transceiver-based links and require FPGA-based interface logic and buffering.
• Complex FPGA compute  Large logic element count and significant embedded RAM make the device appropriate for custom acceleration, signal processing, and protocol handling.
• High‑I/O systems  Systems needing extensive parallel or multi‑channel connectivity benefit from the 600 I/O availability.

Unique Advantages

• High logic density: Approximately 340k logic elements enable large-scale designs and integration of multiple functions on a single device.
• Substantial on-chip memory: Approximately 19.456 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
• Extensive I/O capability: 600 I/Os allow flexible interfacing to peripherals, sensors, and high-speed links without excessive external multiplexing.
• Industrial reliability: Rated for −40 °C to 100 °C operation, supporting deployment in temperature-challenging environments.
• Compact BGA packaging: 780-ball FCBGA (33×33) provides high pin count in a compact surface-mount form factor for space-constrained PCBs.
• Compliance-ready: RoHS compliance simplifies design for regulated manufacturing processes.

Why Choose 5SGXMA3E3H29I3WN?

The 5SGXMA3E3H29I3WN combines significant programmable logic resources, ample embedded memory, and a very high I/O count in an industrial-grade Stratix V GX device. These attributes make it well suited to engineers building high-performance, I/O‑intensive systems that require on-chip capacity for both logic and data storage.

Its defined core voltage range and BGA packaging support integration into advanced system designs where board space, power planning, and thermal performance are critical. For teams designing communications, signal processing, or complex control systems, this device delivers a platform with measurable specifications and industrial operating range.

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