5SGXMA3E3H29I4G

The 5SGXMA3E3H29I4G is an Intel Stratix® V GX field programmable gate array in a 780‑BBGA (FCBGA) package designed for high-density, high‑performance digital logic and system integration. It combines a large logic fabric with substantial embedded memory and an extensive I/O complement for complex FPGA designs.

Targeted at industrial‑grade applications, this device offers a wide operating temperature range (−40 °C to 100 °C), a low core voltage range (820 mV to 880 mV), and up to 600 user I/Os, making it suitable for demanding environments where scalable logic capacity and robust I/O are required.

Key Features

• Core & logic capacity  340,000 logic elements (LEs) to implement large, complex digital designs and custom architectures.
• Embedded memory  Approximately 19.456 Mbits of on‑chip RAM for large buffering, lookup tables, and state storage.
• I/O density  Up to 600 user I/Os to support broad parallel connectivity and multiple high‑speed interfaces.
• Transceiver speed grades (device family)  Stratix V GX devices include transceiver speed grades documented in the family datasheet (for example, GX channel speeds up to 14.1 Gbps), enabling high‑speed serial links where required.
• Power and supply  Core operating voltage range of 820 mV to 880 mV for the device core supply.
• Package & mounting  780‑BBGA (FCBGA) supplier package (780‑HBGA, 33 × 33 mm footprint) with surface‑mount assembly for compact, high‑pin‑count system designs.
• Industrial temperature grade  Rated for −40 °C to 100 °C operation for deployment in industrial environments.
• RoHS compliant  Device is compliant with RoHS environmental requirements.

Typical Applications

• High‑performance compute and acceleration  Large logic capacity and on‑chip memory make the device suitable for custom accelerators and compute‑intensive algorithms.
• Telecommunications and high‑speed serial interfaces  GX transceiver speed grades available in the Stratix V family support implementation of high‑speed links and backplane interfaces.
• Industrial control and automation  Industrial temperature rating and large I/O count enable complex control, sensor aggregation, and deterministic I/O processing.
• Prototyping and system integration  High logic density and extensive I/O facilitate integration of multiple system functions into a single FPGA for rapid prototyping or system consolidation.

Unique Advantages

• High logic density: 340,000 logic elements provide headroom for large designs and deep pipelining without external logic.
• Substantial embedded memory: Approximately 19.456 Mbits of RAM enables large buffers, tables, and store‑and‑forward architectures on chip.
• Extensive connectivity: 600 I/Os support multiple parallel interfaces, buses, and front‑panel or backplane connections.
• Industrial temperature range: −40 °C to 100 °C rating supports deployment in harsher environments and industrial systems.
• Compact, high‑pin‑count package: 780‑BBGA (33 × 33 mm) package delivers high I/O and ball count in a space‑efficient footprint.
• Low core voltage operation: 820–880 mV core supply supports modern low‑voltage FPGA core designs and power planning.

Why Choose 5SGXMA3E3H29I4G?

The 5SGXMA3E3H29I4G positions itself as a high‑capacity Stratix V GX FPGA for designers who need large logic resources, significant embedded memory, and extensive I/O in an industrial‑rated package. Its combination of 340,000 logic elements, approximately 19.456 Mbits of on‑chip RAM, and 600 I/Os supports system consolidation and high‑density implementations.

Backed by Intel’s Stratix V device family documentation and datasheet detail, this device is well suited for industrial applications, high‑speed communications, compute acceleration, and complex control systems where long‑term scalability, thermal robustness, and a high‑pin‑count package are important design considerations.

Request a quote or submit a procurement inquiry to get pricing, availability, and support information for the 5SGXMA3E3H29I4G. Our team can provide lead‑time details and help integrate this device into your design workflow.