5SGXMA3E3H29C4WN

The 5SGXMA3E3H29C4WN is a Stratix V GX family FPGA from Intel, delivered in a 780-BBGA (FCBGA) package. It provides a high-capacity programmable fabric with substantial embedded memory and a large I/O count for complex, high-density designs.

Designed for commercial-temperature operation, this device targets applications that require extensive logic resources, on-chip memory, and broad I/O connectivity while operating from a low-voltage core supply.

Key Features

• Logic Capacity 340,000 logic elements (logic cells) for implementing large-scale digital designs and custom processing pipelines.
• Embedded Memory Approximately 19.5 Mbits of on-chip RAM to support buffers, FIFOs, and embedded data storage.
• I/O Resources Up to 600 general-purpose I/O pins to interface with high-pin-count systems and multiple peripherals.
• Power and Core Supply Specified core voltage supply range of 820 mV to 880 mV for the device core.
• Package and Mounting 780-BBGA (FCBGA) package, supplier device package listed as 780-HBGA (33×33); surface-mount mounting type.
• Temperature Grade Commercial grade operation with an operating temperature range of 0 °C to 85 °C.
• Standards Compliance RoHS compliant.

Typical Applications

• High-density programmable logic Implement complex state machines, datapath accelerators, and large custom logic blocks using the device's extensive logic element count.
• Memory-intensive functions Use the approximately 19.5 Mbits of embedded memory for buffering, packet queues, and on-chip data storage.
• High-pin-count interfaces Leverage up to 600 I/Os to connect multiple interfaces, I/O buses, or parallel data paths in system designs.
• Embedded processing and acceleration Deploy hardware accelerators and custom compute blocks where significant logic and memory resources are required.

Unique Advantages

• Large programmable fabric: 340,000 logic elements provide the capacity to consolidate multiple functions into a single device, reducing board-level integration complexity.
• Substantial on-chip memory: Approximately 19.5 Mbits of embedded RAM helps minimize external memory needs and improves data path latency.
• High I/O density: 600 I/Os enable broad connectivity for multi-channel systems, sensors, and parallel interfaces without additional I/O expanders.
• Compact BGA packaging: 780-BBGA (33×33) package offers a dense footprint suitable for compact system boards while supporting surface-mount assembly.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation for typical commercial deployments and controlled-environment systems.
• Low-voltage core: Core supply range of 820 mV to 880 mV supports integration into modern low-voltage power architectures.
• Regulatory compliance: RoHS compliance supports environmentally conscious manufacturing and procurement.

Why Choose 5SGXMA3E3H29C4WN?

The 5SGXMA3E3H29C4WN positions itself as a high-capacity, commercially rated Stratix V GX FPGA tailored for engineers who need extensive logic resources, sizable on-chip memory, and a large number of I/Os in a compact BGA package. Its low-voltage core operation and RoHS compliance make it suitable for modern commercial designs where board-level integration and regulatory considerations matter.

As part of the Stratix V family, this device is supported by the series documentation and design resources provided by the manufacturer, making it a practical choice for teams developing scalable, logic- and I/O-intensive systems.

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