5SGXMA3E3H29C3WN

The 5SGXMA3E3H29C3WN is a Stratix® V GX field-programmable gate array (FPGA) from Intel, designed for high-density programmable logic applications. It provides a large logic fabric, substantial on-chip memory, and a high I/O count in a compact ball-grid array package.

As a commercial-grade device, this Stratix V GX part targets designs that require significant logic capacity, abundant connectivity, and low-voltage core operation while operating within a 0 °C to 85 °C temperature range.

Key Features

• Core Logic  Approximately 340,000 logic elements for implementing large, complex digital designs.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support data buffering, FIFOs, and local storage.
• I/O Capability  600 user I/Os to enable dense external interfacing and broad connectivity options.
• Package & Mounting  780-BBGA (FCBGA) package; supplier device package listed as 780-HBGA (33×33). Surface-mount device for compact PCB implementations.
• Power  Core voltage supply range of 820 mV to 880 mV for low-voltage operation.
• Operating Conditions & Grade  Commercial temperature grade specified for operation from 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-density digital designs  Implement large-scale combinational and sequential logic where substantial logic elements and on-chip memory are required.
• Systems with heavy I/O requirements  Use where hundreds of external signals or interfaces must be connected directly to the FPGA fabric.
• Compact, high-pin-count PCBs  Deploy the 780-BBGA package on space-constrained boards that need a high-pin-count FPGA in a surface-mount form factor.

Unique Advantages

• High logic density: The roughly 340,000 logic elements reduce the need for multiple devices in complex designs.
• Significant on-chip memory: Approximately 19.456 Mbits of embedded RAM supports large buffers and state storage without external memory.
• Extensive I/O count: 600 I/Os enable broad peripheral and subsystem integration directly to the FPGA.
• Compact high-pin package: 780-BBGA (780-HBGA supplier package, 33×33) packs high pin count into a compact footprint for PCB density.
• Low-voltage core compatibility: Core supply range of 820–880 mV aligns with low-voltage system designs.
• Commercial temperature rating: Specified for operation from 0 °C to 85 °C where commercial-grade performance is required.

Why Choose 5SGXMA3E3H29C3WN?

The 5SGXMA3E3H29C3WN combines substantial logic capacity, significant embedded memory, and a very high I/O count in a compact BGA package, making it well suited for complex digital systems that demand integration and board-level density. Its low-voltage core range and RoHS compliance further align it with modern power-sensitive, environmentally compliant designs.

This Stratix V GX device is positioned for teams designing commercial-grade products that require scalability in logic and memory resources while maintaining a compact footprint and broad external connectivity.

Request a quote or submit a pricing inquiry to begin procurement for the 5SGXMA3E3H29C3WN.