5SGXMA3E3H29C3G

The 5SGXMA3E3H29C3G is a Stratix V GX Field Programmable Gate Array (FPGA) provided in a 780‑BBGA FCBGA package. It delivers high logic capacity and on‑chip memory suitable for complex digital designs requiring extensive I/O and embedded RAM.

Key device attributes include 340,000 logic elements, approximately 19.456 Mbits of embedded memory, 600 I/O pins, a supply voltage range of 820–880 mV, and a commercial operating temperature range of 0 °C to 85 °C. The device is RoHS compliant and supplied as a surface‑mount FCBGA package (780‑HBGA, 33×33).

Key Features

• Core Logic Capacity  340,000 logic elements for implementing large-scale combinational and sequential logic networks.
• Embedded Memory  Approximately 19.456 Mbits of on‑chip RAM to support buffering, lookup tables, and state storage within the FPGA fabric.
• I/O Resources  600 I/O pins to accommodate extensive peripheral interfacing and multi‑lane connectivity requirements.
• Power Supply  Core supply voltage range of 820 mV to 880 mV, enabling designs that target the specified core operating conditions.
• Package and Mounting  780‑BBGA FCBGA package (supplier package: 780‑HBGA, 33×33) in a surface‑mount form factor for high‑density PCB integration.
• Operating Grade and Temperature  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• RoHS Compliant  Device material and assembly conform to RoHS requirements.
• Family Transceiver Capability (series-level)  The Stratix V GX family documentation lists transceiver speed grades including up to 14.1 Gbps (family-level data referenced from the Stratix V device datasheet).

Typical Applications

• High‑density digital processing  Large logic capacity and embedded RAM enable implementation of complex datapaths, state machines, and custom accelerators.
• Multi‑lane I/O systems  600 I/O pins support extensive parallel and serial interfacing for board‑level connectivity and multi‑interface designs.
• On‑chip buffering and memory‑intensive logic  Approximately 19.456 Mbits of embedded memory for packet buffering, LUTs, and temporary data storage within FPGA fabric.

Unique Advantages

• High logic density: 340,000 logic elements reduce reliance on external logic devices for complex implementations.
• Significant on‑chip memory: Approximately 19.456 Mbits of embedded RAM enables efficient local data handling and state retention.
• Extensive I/O count: 600 I/O pins provide flexibility for multiple peripherals, parallel buses, and high-pin‑count interfaces.
• Commercial temperature grade: Rated for 0 °C to 85 °C operation for a wide range of standard commercial applications.
• Robust package option: 780‑BBGA FCBGA (780‑HBGA, 33×33) surface‑mount package supports high‑density PCB assembly.
• Standards‑aware family characteristics: Stratix V GX family documentation includes high‑speed transceiver speed grades (family-level reference), useful when evaluating system‑level connectivity requirements.

Why Choose 5SGXMA3E3H29C3G?

The 5SGXMA3E3H29C3G combines large programmable logic capacity, substantial embedded memory, and a high I/O count in a commercial‑grade surface‑mount FCBGA package. These characteristics make it suitable for designers who need substantial on‑chip resources and flexible interfacing in board‑level FPGA implementations.

Choosing this Stratix V GX device supports scalable, high‑density designs where integrated RAM and extensive I/O reduce external component count and simplify system architecture. The device benefits from documented family‑level electrical and transceiver characteristics in the Stratix V datasheet for design planning and validation.

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