5SGXMA3E3H29C2N
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 19456000 340000 780-BBGA, FCBGA |
|---|---|
| Quantity | 779 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 780-HBGA (33x33) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 600 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 128300 | Number of Logic Elements/Cells | 340000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 19456000 |
Overview of 5SGXMA3E3H29C2N – Stratix® V GX FPGA, 340,000 logic elements, 600 I/Os, 780-BBGA (FCBGA)
The 5SGXMA3E3H29C2N is a Stratix® V GX Field Programmable Gate Array (FPGA) from Intel, delivered in a 780-BBGA (FCBGA) package. It integrates a large programmable logic fabric and abundant on-chip memory, making it appropriate for designs that require high logic capacity and extensive I/O connectivity.
With 340,000 logic elements and approximately 19.456 Mbits of embedded memory, this commercial-grade device supports designs that need dense logic, significant embedded RAM, and up to 600 I/Os while operating within a supply range of 870 mV to 930 mV and a commercial temperature range of 0 °C to 85 °C.
Key Features
- Core logic capacity — 340,000 logic elements provide a large programmable fabric for complex logic and custom processing pipelines.
- Embedded memory — Approximately 19.456 Mbits of on-chip RAM to support buffering, FIFOs, and on-chip data storage without external memory for many functions.
- I/O density — Up to 600 I/Os to support systems with extensive peripheral, sensor, or high-pin-count interface requirements.
- Family transceiver options — As a Stratix V GX device family member, Stratix V devices are offered in transceiver speed grades including channel rates up to 14.1 Gbps (family-level characteristic documented in the Stratix V device datasheet).
- Power and supply — Core voltage supply range from 870 mV to 930 mV for compatibility with defined system power rails.
- Commercial temperature grade — Rated for operation from 0 °C to 85 °C for commercial-environment deployments.
- Package and mounting — 780-BBGA (FCBGA) package; supplier device package listed as 780-HBGA (33 × 33), surface-mount mounting suitable for standard PCB assembly.
- RoHS compliant — Meets RoHS environmental requirements.
Typical Applications
- High-density logic implementations — Use the large logic element count for complex state machines, custom accelerators, and deep pipelined designs.
- Data buffering and on-chip processing — Approximately 19.456 Mbits of embedded RAM supports packet buffering, FIFO queues, and local data storage to reduce external memory dependence.
- High-pin-count interfacing — With up to 600 I/Os, the device suits systems that require numerous GPIOs, parallel interfaces, or multiple peripheral connections.
- Commercial embedded systems — The commercial grade and 0 °C to 85 °C operating range align with many industrial, communications, and enterprise applications operating in controlled environments.
Unique Advantages
- Substantial logic resources: 340,000 logic elements enable integration of large functions on a single device, reducing board-level partitioning.
- Significant on-chip memory: Approximately 19.456 Mbits of embedded RAM helps minimize external memory bandwidth and component count for many use cases.
- High I/O count: 600 available I/Os simplify connectivity to peripherals and parallel interfaces without external multiplexing.
- Commercial-grade readiness: Rated for 0 °C to 85 °C and RoHS compliant for deployments in commercial environments.
- Standard surface-mount package: 780-BBGA (FCBGA) package and 33 × 33 supplier package footprint support established PCB assembly and thermal design practices.
- Family-level transceiver options: Stratix V GX family documentation includes transceiver speed grades up to 14.1 Gbps, providing a pathway for high-speed serial connectivity within the family.
Why Choose 5SGXMA3E3H29C2N?
This Stratix® V GX FPGA balances large logic capacity, substantial embedded memory, and a high I/O count in a commercial-grade FCBGA package. It is suited to designers who need to consolidate complex logic, buffering, and dense interfacing into a single programmable device while operating within standard commercial temperature and supply ranges.
Backed by Intel’s Stratix V family documentation and device characterization, the 5SGXMA3E3H29C2N is appropriate for teams building scalable, FPGA-based systems that require verified device-level specifications and predictable supply requirements.
Request a quote or submit a purchase inquiry to begin procurement and evaluate the 5SGXMA3E3H29C2N for your next design project.

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