5SGXMA3E3H29C2G

IC FPGA 600 I/O 780HBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 19456000 340000 780-BBGA, FCBGA

Quantity 263 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package780-HBGA (33x33)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGA, FCBGANumber of I/O600Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs128300Number of Logic Elements/Cells340000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits19456000

Overview of 5SGXMA3E3H29C2G – Stratix V GX FPGA, 340000 logic elements, ~19.5 Mbits, 600 I/Os

The 5SGXMA3E3H29C2G is an Intel Stratix® V GX field-programmable gate array (FPGA) supplied in a 780-BBGA FCBGA package. It delivers a high-density programmable logic fabric with 340,000 logic elements, approximately 19.5 Mbits of embedded memory, and up to 600 I/O pins for I/O‑intensive designs.

Designed for commercial-grade applications, the device operates with a core voltage supply between 870 mV and 930 mV and a commercial temperature rating of 0 °C to 85 °C. It is RoHS compliant and intended for surface-mount applications requiring dense integration and large on-chip memory.

Key Features

  • Core Logic  340,000 logic elements provide a large programmable fabric for complex digital designs and high-density integration.
  • Embedded Memory  Approximately 19.5 Mbits of on-chip RAM to support buffering, FIFOs, and memory-intensive algorithms without external memory.
  • I/O Capacity  Up to 600 I/O pins to support extensive external connectivity and parallel interfaces.
  • Power and Voltage  Core supply range of 870 mV to 930 mV for designs targeting Stratix V core voltage domains.
  • Package  780-BBGA (FCBGA), supplier device package listed as 780-HBGA (33×33), optimized for high pin-count, high-density board layouts.
  • Commercial Temperature Grade  Rated for 0 °C to 85 °C operation for standard commercial applications.
  • Surface Mount  Surface-mount package suitable for modern PCB assembly processes.
  • Compliance  RoHS compliant to support environmental and regulatory requirements.
  • Stratix V GX Family Characteristics  The Stratix V family documentation indicates available GX transceiver speed grades within the series, providing context for designs that require high-speed serial links (family-level information).

Typical Applications

  • High-density digital processing  Large logic capacity and on-chip memory make the device suitable for complex FPGA-implemented algorithms and custom compute pipelines.
  • I/O‑intensive systems  600 I/Os enable broad interfacing to sensors, peripherals, or parallel data buses.
  • Prototyping and system integration  High logic and memory resources support system-on-chip prototyping and consolidation of multiple functions into a single device.
  • High-speed serial link designs (family-level)  Stratix V GX family documentation provides transceiver-grade options useful when planning designs that leverage the family’s serial connectivity capabilities.

Unique Advantages

  • Highly integrated logic and memory: Combining 340,000 logic elements with approximately 19.5 Mbits of embedded RAM reduces dependency on external components and simplifies board-level design.
  • Large I/O count: 600 I/Os provide flexibility for complex interfacing requirements and dense systems integration.
  • Compact, high‑pin package: The 780‑BBGA FCBGA package supports high pin-count routing in a space-efficient footprint for advanced PCB layouts.
  • Commercial operating range: Rated 0 °C to 85 °C to meet typical commercial application temperature requirements.
  • Controlled core voltage domain: Narrow core supply range (870 mV–930 mV) enables predictable power delivery design for the FPGA core.
  • Regulatory compliance: RoHS compliance supports environmental and regulatory needs for commercial products.

Why Choose 5SGXMA3E3H29C2G?

The 5SGXMA3E3H29C2G positions itself as a high-density commercial FPGA option within the Intel Stratix V GX family, offering a large logic fabric, substantial on-chip memory, and extensive I/O capacity in a 780-BBGA package. These attributes make it well suited for engineers consolidating functions onto a single programmable device, prototyping complex systems, or building I/O-heavy applications that benefit from on-chip resources.

Backed by the Stratix V family documentation, this device is appropriate for designs that require predictable power domains, high logic capacity, and a commercial temperature rating. It provides a platform for scalable designs where integration density and on-chip memory are primary considerations.

Request a quote or contact sales to discuss availability, pricing, and lead times for the 5SGXMA3E3H29C2G.

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