5SGXMA3E3H29C2LN

The 5SGXMA3E3H29C2LN is a Stratix V GX field-programmable gate array (FPGA) in a 780-BBGA FCBGA package intended for commercial-grade designs. It provides a high logic element count, substantial on-chip RAM, and a large I/O complement for complex, high-density digital systems. Design goals supported by this device include high I/O density, significant embedded memory capacity, and transceiver-capable architectures as described in the Stratix V device documentation.

Key Features

• Core Logic — 340,000 logic elements for implementing large and complex digital designs.
• Embedded Memory — Approximately 19.456 Mbits of on-chip RAM to support buffering, packet processing, and large state machines.
• I/O Density — 600 user I/O pins to support high-pin-count interfacing and multi-channel connectivity.
• Transceiver Capability (device family) — Stratix V GX device documentation references transceiver speed grades including GX channel options up to 14.1 Gbps and 12.5 Gbps, enabling high-speed serial interface designs where applicable to the device family.
• Power and Supply — Core supply requirement specified at 820 mV to 880 mV for compatibility with low-voltage core power domains.
• Package & Mounting — 780-BBGA, FCBGA package; supplier device package referenced as 780-HBGA (33x33); surface-mount device suitable for standard PCB assembly.
• Operating Range & Grade — Commercial-grade device rated for operation from 0 °C to 85 °C.
• Environmental — RoHS compliant.

Typical Applications

• High-density digital processing — Implement large combinational and sequential logic blocks using 340,000 logic elements for compute-heavy hardware acceleration.
• Memory-intensive designs — Use approximately 19.456 Mbits of embedded memory for buffering, deep FIFOs, and state storage.
• High I/O systems — Support complex multi-channel interfaces and board-level connectivity with 600 I/O pins.
• High-speed serial interfaces — Leverage Stratix V GX transceiver speed grade information from the device family for designs that require multi-gigabit serial links.

Unique Advantages

• High logic capacity: 340,000 logic elements enable large-scale finite-state machines, datapaths, and custom accelerators without immediate need to partition functions across multiple devices.
• Substantial on-chip RAM: Approximately 19.456 Mbits of embedded memory reduces external memory dependency and simplifies board-level memory architectures.
• Extensive I/O: 600 I/Os provide flexibility for parallel interfaces, broad sensor arrays, or multi-channel front-ends.
• Low-voltage core compatibility: Core supply specified between 820 mV and 880 mV aligns with low-voltage FPGA core domains and power-optimized system designs.
• Commercial temperature rating: Rated 0 °C to 85 °C for standard commercial applications and environments.
• Regulatory compliance: RoHS compliant for environmentally conscious manufacturing and supply-chain requirements.

Why Choose 5SGXMA3E3H29C2LN?

The 5SGXMA3E3H29C2LN combines a high logic-element count, substantial embedded RAM, and a large I/O complement in a single commercial-grade Stratix V GX FPGA package. It is suited to designers who need dense programmable logic, significant on-chip memory, and extensive board-level interfacing while operating within standard commercial temperature ranges. The device’s documented Stratix V GX transceiver capabilities and low-voltage core supply make it appropriate for systems that require multi-gigabit serial interfaces and power-conscious core designs.

Choosing this device supports scalable hardware implementations within the Stratix V family and leverages the device documentation for transceiver and electrical characteristics during system design and validation.

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