5SGXMA3E2H29I3WN

The 5SGXMA3E2H29I3WN is a Stratix V GX Field Programmable Gate Array (FPGA) in a 780-BBGA (FCBGA) package. It delivers large digital fabric density and substantial embedded memory alongside a high pin-count I/O interface for demanding system designs.

Targeted at industrial-grade applications, this Stratix V GX device combines approximately 340,000 logic elements with on-chip memory, broad I/O, and defined operating and supply ranges to enable high-integration board and system implementations.

Key Features

• Core density — Approximately 340,000 logic elements supported by 128,300 LAB/CLB resources for complex logic and parallel datapaths.
• Embedded memory — Approximately 19.456 Mbits of on-chip RAM for buffering, lookup tables, and state storage.
• I/O capacity — 600 I/O pins to support wide parallel interfaces, multiple peripherals, and high pin-count board connections.
• Transceiver family (series-level) — As a member of the Stratix V GX family, the series provides GX transceiver speed grade options at the family level (see series datasheet for grade details).
• Power — Core supply operating range from 820 mV to 880 mV to match system power-rail design requirements.
• Package & mounting — 780-BBGA (supplier package listed as 780-HBGA, 33×33) in a surface-mount form factor for compact board integration.
• Temperature & grade — Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in controlled industrial environments.
• Environmental compliance — RoHS compliant.

Typical Applications

• High-speed networking and communications — Use the Stratix V GX family’s transceiver-grade capabilities together with 600 I/Os for board-level interfaces and high-bandwidth links (series-level feature).
• High-density signal processing — Leverage ~340,000 logic elements and ~19.456 Mbits of embedded memory for packet processing, DSP pipelines, and algorithm acceleration.
• Industrial systems and instrumentation — Industrial temperature rating and surface-mount 780-BBGA package support compact, rugged system designs for factory and test applications.

Unique Advantages

• High logic capacity: Approximately 340,000 logic elements enable large, parallel hardware implementations and complex control logic.
• Substantial on-chip memory: Approximately 19.456 Mbits of embedded RAM reduces external memory dependency and simplifies board-level memory architecture.
• Extensive I/O: 600 I/Os provide flexibility for multi-channel interfaces, peripheral aggregation, and wide bus implementations.
• Industrial operating range: −40 °C to 100 °C qualification supports deployment in many industrial environments where broader temperature tolerance is required.
• Compact BGA integration: 780-BBGA (33×33 supplier package) surface-mount package offers high-pin density in a compact footprint for space-constrained designs.
• Regulatory readiness: RoHS compliance supports environmentally conscious manufacturing and assembly processes.

Why Choose 5SGXMA3E2H29I3WN?

The 5SGXMA3E2H29I3WN provides a balance of high logic density, sizable embedded memory, and large I/O capacity in an industrial-grade Stratix V GX device. Its 780-BBGA surface-mount package and defined core supply and temperature ranges make it suitable for system designs that require integration of complex logic, significant on-chip RAM, and substantial interface counts.

This device is well suited for design teams building high-density processing, communications, or industrial instrumentation systems that rely on the Stratix V GX family’s documented electrical and switching characteristics. The part’s combination of capacity, I/O, and package options supports scalable hardware architectures and board-level integration strategies.

Request a quote or submit an inquiry today to discuss pricing, availability, and how 5SGXMA3E2H29I3WN can fit into your next design.