5SGXMA3E2H29I3L

The 5SGXMA3E2H29I3L is an Intel Stratix V GX family FPGA delivering high-density programmable logic and large on-chip memory in a 780-ball BGA package. It combines approximately 340,000 logic elements with significant embedded RAM and extensive I/O to support industrial-grade designs that require dense logic integration and robust I/O capacity.

This device is offered in an industrial temperature grade and supports the Stratix V GX device family electrical characteristics and transceiver speed options described in the device datasheet, making it suitable for designs that must operate across a broad temperature range with defined core voltage requirements.

Key Features

• Logic Capacity — Approximately 340,000 logic elements (cells) for high-density programmable logic and complex FPGA implementations.
• Embedded Memory — Approximately 19.456 Mbits of on-chip RAM to support large buffering, lookup tables, and memory-intensive processing.
• I/O Density — 600 available I/O pins to enable large peripheral connectivity and multi-channel interfaces.
• Transceiver/Family Support — Part of the Stratix V GX family; the device series documentation details GX transceiver speed grades for multi-gigabit channel support.
• Power and Core Voltage — Core supply range specified at 820 mV to 880 mV to meet the device’s electrical operating requirements.
• Package and Mounting — 780-ball BGA FCBGA package (supplier package: 780-HBGA, 33×33) with surface-mount mounting for dense PCB integration.
• Industrial Temperature Grade — Rated for operation from –40 °C to 100 °C for industrial-environment applications.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Industrial Control and Automation — Industrial temperature rating and wide operating range make the device suitable for logic-intensive control systems and factory automation that require reliable operation across extended temperatures.
• High-Density Signal Processing — Large logic capacity and substantial embedded RAM support signal processing pipelines, data aggregation, and custom hardware acceleration functions.
• Communications and Networking — High I/O count and Stratix V GX family transceiver capabilities enable multi-channel interfacing and support for communication infrastructure building blocks.

Unique Advantages

• High Logic Integration: Approximately 340,000 logic elements enable consolidation of complex functions into a single FPGA, reducing system-level component count.
• Large On‑Chip RAM: About 19.456 Mbits of embedded memory supports buffering, packet processing, and stateful algorithms without external memory in many use cases.
• Extensive I/O: 600 I/O pins provide flexibility for interfacing a wide range of peripherals, sensors, and high-speed links.
• Industrial-Grade Operation: Specified operation from –40 °C to 100 °C targets industrial deployments where temperature robustness is required.
• Compact BGA Packaging: 780-ball BGA (780-HBGA, 33×33) surface-mount package enables dense PCB layouts while maintaining high pin count.
• Standards-Conscious Design: RoHS compliance supports environmental and regulatory considerations for modern electronics manufacturing.

Why Choose 5SGXMA3E2H29I3L?

The 5SGXMA3E2H29I3L delivers a balance of high logic capacity, substantial embedded memory, and extensive I/O in an industrial-temperature, RoHS-compliant FPGA package. Its family-level Stratix V GX characteristics and specified core voltage range make it suitable for engineers looking to implement dense, performance-oriented FPGA designs that must operate reliably across a wide temperature span.

Choose this device for designs that require scalable logic resources, on-chip memory for buffering and algorithm implementation, and a high number of I/O channels in a compact BGA form factor. The combination of these attributes supports long-term design stability and enables integration of complex functions onto a single programmable device.

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