5SGXMA3E2H29I2LN

The 5SGXMA3E2H29I2LN is an industrial-grade Stratix® V GX field programmable gate array (FPGA) supplied in a 780-BBGA FCBGA package. It delivers high logic integration, abundant embedded memory, and a large I/O complement for complex, high-density designs.

Designed for applications that require substantial logic capacity and system I/O, this device combines 340,000 logic elements with approximately 19.456 Mbits of on-chip RAM and 600 general-purpose I/Os, enabling compact implementation of sophisticated digital functions within a surface-mount 780-HBGA (33×33) footprint.

Key Features

• Core Logic  340,000 logic elements for implementing large-scale digital logic and custom hardware acceleration.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support buffering, lookup tables, and state retention without external memory.
• I/O Density  600 I/Os to support wide parallel interfaces, dense peripheral connectivity, and multi-channel systems.
• Package & Mounting  780-BBGA (FCBGA) package; supplier device package 780-HBGA (33×33); surface-mount mounting for compact PCB integration.
• Power  Core supply specified at 820 mV to 880 mV, enabling integration in designs that target this low-voltage FPGA core domain.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C, suitable for industrial and other temperature-demanding environments.
• Regulatory  RoHS compliant.

Typical Applications

• Industrial Control and Automation  Use in control systems where the −40 °C to 100 °C operating range and high I/O count enable robust interfacing and local processing.
• High-density Logic Integration  Implement complex state machines, datapath logic, or hardware accelerators leveraging 340,000 logic elements and significant embedded memory.
• Multi-channel I/O Systems  Systems requiring many parallel or multiplexed I/Os can take advantage of the device’s 600 I/Os for sensors, actuators, and wide bus interfaces.

Unique Advantages

• Significant Logic Capacity: 340,000 logic elements enable consolidation of large designs onto a single FPGA, reducing board-level complexity.
• Substantial On-chip Memory: Approximately 19.456 Mbits of embedded RAM reduces dependence on external memory for buffering and state storage.
• High I/O Count: 600 I/Os support dense connectivity for multi-channel systems and complex peripheral interfaces.
• Industrial Temperature Range: −40 °C to 100 °C rating supports deployment in demanding environments where extended temperature tolerance is required.
• Compact, Surface-mount Package: 780-BBGA (33×33) FCBGA package provides a space-efficient footprint for high-density designs.
• RoHS Compliant: Conforms to RoHS requirements for materials compliance.

Why Choose 5SGXMA3E2H29I2LN?

The 5SGXMA3E2H29I2LN positions itself as a high-capacity, industrially graded member of the Stratix V GX family, combining extensive logic resources, sizeable embedded memory, and a broad I/O complement in a compact BGA package. Its specified core voltage range and wide operating temperature make it suitable for designs where integration density and environmental robustness are important.

This device is appropriate for engineering teams building complex digital systems that require significant on-chip resources and high channel counts, offering a scalable platform within the Stratix V GX device family.

Request a quote or submit an inquiry to obtain pricing and availability for part number 5SGXMA3E2H29I2LN.