5SGXMA3E2H29C3WN

IC FPGA 600 I/O 780HBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 19456000 340000 780-BBGA, FCBGA

Quantity 1,374 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package780-HBGA (33x33)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGA, FCBGANumber of I/O600Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs128300Number of Logic Elements/Cells340000
Number of GatesN/AECCNOBSOLETEHTS CodeN/A
QualificationN/ATotal RAM Bits19456000

Overview of 5SGXMA3E2H29C3WN – Stratix® V GX FPGA, 340,000 logic elements, approximately 19.456 Mbits RAM, 600 I/O, 780-BBGA FCBGA

The 5SGXMA3E2H29C3WN is a Stratix® V GX field programmable gate array (FPGA) IC in a 780-BBGA FCBGA package, offered in a commercial temperature grade. Built for designs that require large logic capacity and extensive I/O, this device delivers substantial on-chip resources for complex digital systems.

Key attributes include approximately 340,000 logic elements, approximately 19.456 Mbits of embedded memory, and up to 600 I/O pins. The device operates from a core supply of 820 mV to 880 mV and is rated for surface-mount assembly with an operating temperature range of 0°C to 85°C.

Key Features

  • Core Logic  Approximately 340,000 logic elements for high-density implementation of custom logic, state machines, and datapaths.
  • Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage for compute-intensive designs.
  • I/O Capacity  Up to 600 I/O pins to support wide parallel interfaces, multiple peripherals, and extensive board-level connectivity.
  • Power Supply  Core voltage range of 820 mV to 880 mV, enabling designs targeting the specified Stratix V core operating window.
  • Package & Mounting  780-BBGA, FCBGA supplier package (780-HBGA, 33×33) with surface-mount mounting for standard PCB assembly flows.
  • Temperature Grade  Commercial grade operation from 0°C to 85°C for mainstream electronic applications.
  • Compliance  RoHS compliant, aligning with common environmental and manufacturing requirements.
  • Stratix V GX Family Characteristics  Part of the Stratix V GX family detailed in the device datasheet, which documents the series’ electrical characteristics and transceiver capability options for high-speed channel configurations.

Typical Applications

  • Communications & Networking  Large logic capacity and extensive I/O make this FPGA suitable for protocol processing, packet handling, and multi-gigabit channel implementations using the Stratix V GX family characteristics.
  • High-Density DSP & Signal Processing  Substantial embedded memory and logic resources support filtering, transforms, and pipeline processing for real-time signal paths.
  • Prototyping & System Integration  Ample I/O and logic resources enable integration of complex SoC emulation, accelerator prototyping, and interface bridging on a single device.
  • Imaging & Video Processing  Large on-chip RAM and logic elements assist in frame buffering, scaling, and parallel pixel processing architectures.

Unique Advantages

  • Significant Logic Density: Approximately 340,000 logic elements provide capacity for complex algorithms and multi-module designs without immediate need for multiple FPGAs.
  • Substantial On-Chip Memory: Approximately 19.456 Mbits of embedded memory reduces dependence on external RAM for mid-sized buffering and local data storage.
  • Extensive I/O Count: 600 I/O pins simplify board-level connectivity and reduce the need for external multiplexing in dense-interface systems.
  • Commercial Temperature Suitability: Rated for 0°C to 85°C operation to match typical commercial deployments and environments.
  • RoHS Compliant: Meets common environmental requirements for modern electronics production.
  • Standard Surface-Mount Package: 780-BBGA FCBGA (supplier package 780-HBGA, 33×33) supports established PCB assembly processes.

Why Choose 5SGXMA3E2H29C3WN?

The 5SGXMA3E2H29C3WN positions itself as a high-capacity Stratix V GX FPGA option for designs that demand abundant logic, ample embedded memory, and broad I/O connectivity within a commercial temperature envelope. Its core voltage window and package choice make it suitable for conventional PCB production and integration into complex systems.

This device is well suited for engineers and system designers building communications, signal processing, or integration-heavy applications who need a single-chip solution with a balanced combination of logic, memory, and I/O resources. Refer to the Stratix V device documentation for series-level electrical and transceiver details relevant to system-level design choices.

Request a quote or submit an inquiry to receive pricing and availability information for the 5SGXMA3E2H29C3WN. Our team can provide lead-time, volume pricing, and support information to help you evaluate this device for your next design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up