5SGXMA3E2H29C3WN
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 19456000 340000 780-BBGA, FCBGA |
|---|---|
| Quantity | 1,374 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 780-HBGA (33x33) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 600 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 128300 | Number of Logic Elements/Cells | 340000 | ||
| Number of Gates | N/A | ECCN | OBSOLETE | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 19456000 |
Overview of 5SGXMA3E2H29C3WN – Stratix® V GX FPGA, 340,000 logic elements, approximately 19.456 Mbits RAM, 600 I/O, 780-BBGA FCBGA
The 5SGXMA3E2H29C3WN is a Stratix® V GX field programmable gate array (FPGA) IC in a 780-BBGA FCBGA package, offered in a commercial temperature grade. Built for designs that require large logic capacity and extensive I/O, this device delivers substantial on-chip resources for complex digital systems.
Key attributes include approximately 340,000 logic elements, approximately 19.456 Mbits of embedded memory, and up to 600 I/O pins. The device operates from a core supply of 820 mV to 880 mV and is rated for surface-mount assembly with an operating temperature range of 0°C to 85°C.
Key Features
- Core Logic Approximately 340,000 logic elements for high-density implementation of custom logic, state machines, and datapaths.
- Embedded Memory Approximately 19.456 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage for compute-intensive designs.
- I/O Capacity Up to 600 I/O pins to support wide parallel interfaces, multiple peripherals, and extensive board-level connectivity.
- Power Supply Core voltage range of 820 mV to 880 mV, enabling designs targeting the specified Stratix V core operating window.
- Package & Mounting 780-BBGA, FCBGA supplier package (780-HBGA, 33×33) with surface-mount mounting for standard PCB assembly flows.
- Temperature Grade Commercial grade operation from 0°C to 85°C for mainstream electronic applications.
- Compliance RoHS compliant, aligning with common environmental and manufacturing requirements.
- Stratix V GX Family Characteristics Part of the Stratix V GX family detailed in the device datasheet, which documents the series’ electrical characteristics and transceiver capability options for high-speed channel configurations.
Typical Applications
- Communications & Networking Large logic capacity and extensive I/O make this FPGA suitable for protocol processing, packet handling, and multi-gigabit channel implementations using the Stratix V GX family characteristics.
- High-Density DSP & Signal Processing Substantial embedded memory and logic resources support filtering, transforms, and pipeline processing for real-time signal paths.
- Prototyping & System Integration Ample I/O and logic resources enable integration of complex SoC emulation, accelerator prototyping, and interface bridging on a single device.
- Imaging & Video Processing Large on-chip RAM and logic elements assist in frame buffering, scaling, and parallel pixel processing architectures.
Unique Advantages
- Significant Logic Density: Approximately 340,000 logic elements provide capacity for complex algorithms and multi-module designs without immediate need for multiple FPGAs.
- Substantial On-Chip Memory: Approximately 19.456 Mbits of embedded memory reduces dependence on external RAM for mid-sized buffering and local data storage.
- Extensive I/O Count: 600 I/O pins simplify board-level connectivity and reduce the need for external multiplexing in dense-interface systems.
- Commercial Temperature Suitability: Rated for 0°C to 85°C operation to match typical commercial deployments and environments.
- RoHS Compliant: Meets common environmental requirements for modern electronics production.
- Standard Surface-Mount Package: 780-BBGA FCBGA (supplier package 780-HBGA, 33×33) supports established PCB assembly processes.
Why Choose 5SGXMA3E2H29C3WN?
The 5SGXMA3E2H29C3WN positions itself as a high-capacity Stratix V GX FPGA option for designs that demand abundant logic, ample embedded memory, and broad I/O connectivity within a commercial temperature envelope. Its core voltage window and package choice make it suitable for conventional PCB production and integration into complex systems.
This device is well suited for engineers and system designers building communications, signal processing, or integration-heavy applications who need a single-chip solution with a balanced combination of logic, memory, and I/O resources. Refer to the Stratix V device documentation for series-level electrical and transceiver details relevant to system-level design choices.
Request a quote or submit an inquiry to receive pricing and availability information for the 5SGXMA3E2H29C3WN. Our team can provide lead-time, volume pricing, and support information to help you evaluate this device for your next design.

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