5SGXMA3E2H29C2WN

The 5SGXMA3E2H29C2WN is a Stratix V GX field programmable gate array (FPGA) offered in a commercial temperature grade. It delivers high logic density and on-chip memory in a 780-ball BGA package designed for surface-mount PCB assembly.

Key device characteristics include 340,000 logic elements, approximately 19 Mbits of embedded memory, 600 I/Os, and a documented core voltage operating range of 870 mV to 930 mV. Series documentation provides detailed electrical and transceiver characteristics for Stratix V GX devices.

Key Features

• Core logic capacity — 340,000 logic elements to support complex programmable logic designs and high-density implementations.
• Embedded memory — Total on-chip RAM of 19,456,000 bits (approximately 19 Mbits) for local buffering, code storage, and data-path implementations.
• High I/O count — 600 I/O pins to accommodate multi-channel interfacing and dense peripheral connectivity.
• Power and voltage — Core supply specified between 870 mV and 930 mV to match low-voltage system designs.
• Package and mounting — 780-BBGA (FCBGA) package; supplier device package listed as 780-HBGA (33×33). Device is surface-mount compatible.
• Commercial temperature grade — Rated for operation from 0 °C to 85 °C for commercial applications.
• Standards and compliance — RoHS-compliant material status.
• Series-level transceiver capability (Stratix V GX) — Series documentation for Stratix V GX devices includes transceiver speed grades (for example, GX channel listings up to 14.1 Gbps in the device series datasheet).

Unique Advantages

• High-density programmable fabric: 340,000 logic elements enable complex functions and large-scale logic integration on a single device.
• Substantial embedded memory: Approximately 19 Mbits of on-chip RAM reduces external memory dependency for many buffering and storage needs.
• Extensive I/O resources: 600 I/Os simplify interfacing to multiple external devices and high-pin-count subsystems.
• Compact BGA packaging: 780-ball BGA in a 33×33 supplier package supports high-pin-count board designs while remaining surface-mount friendly.
• Documented electrical and switching data: Series datasheet provides detailed operating conditions and transceiver characteristics to aid design and validation.
• Regulatory compliance: RoHS-compliant construction supports regulatory requirements for commercial products.

Why Choose 5SGXMA3E2H29C2WN?

The 5SGXMA3E2H29C2WN positions itself as a high-density, commercially graded Stratix V GX FPGA choice for designs that require large logic capacity, substantial on-chip memory, and broad I/O capability in a surface-mount BGA package. Its documented voltage and temperature envelope and series-level electrical information support thorough electrical and system-level design validation.

This device suits commercial applications where integration density, I/O count, and accessible series documentation are primary design drivers. The combination of logic resources, embedded RAM, and package options helps designers scale complex programmable functions while relying on the Stratix V GX family datasheet for detailed electrical and transceiver guidance.

Request a quote or submit a pricing inquiry to evaluate the 5SGXMA3E2H29C2WN for your next high-density FPGA design.