5SGXMA3E2H29C2LN

The 5SGXMA3E2H29C2LN is a Stratix® V GX Field Programmable Gate Array (FPGA) IC in a 780-BBGA (FCBGA) package. It integrates 340,000 logic elements, approximately 19.456 Mbits of on-chip RAM, and 600 I/O pins to support high-density digital designs.

Designed as a commercial-grade, surface-mount FPGA, this device operates from a core voltage supply range of 820 mV to 880 mV and across a 0 °C to 85 °C ambient temperature range. It is RoHS compliant and packaged for compact, high-pin-count system integration.

Key Features

• Core Logic  340,000 logic elements for large-scale logic integration and complex FPGA designs.
• On‑Chip Memory  Approximately 19.456 Mbits of embedded RAM to support buffering, state storage, and memory‑intensive logic functions.
• I/O Density  600 available I/O pins to accommodate high-pin-count connectivity and rich peripheral interfacing.
• Package & Mounting  780-BBGA, FCBGA package (supplier device package listed as 780-HBGA, 33×33); surface-mount mounting type for compact board designs.
• Power  Core voltage supply range: 820 mV to 880 mV for defined operating conditions.
• Operating Conditions  Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Standards & Compliance  RoHS compliant.
• Family Documentation  Datasheet details include device electrical characteristics, I/O timing, and transceiver-related specifications for the Stratix V family.

Typical Applications

• High‑density digital processing  Large logic capacity and significant embedded RAM make this device suitable for computationally demanding FPGA implementations.
• High‑I/O system integration  With 600 I/Os and a compact BGA package, it fits designs requiring many external interfaces and dense board layouts.
• Communication and signal interface designs  Stratix V GX family documentation includes transceiver and I/O timing information, supporting applications that depend on robust I/O and high-speed interface handling.

Unique Advantages

• High logic capacity: 340,000 logic elements provide the headroom for complex state machines, datapaths, and custom accelerators.
• Substantial embedded memory: Approximately 19.456 Mbits of on-chip RAM reduces reliance on external memory for many buffering and storage needs.
• Extensive I/O: 600 I/O pins enable broad peripheral connectivity and flexible routing for multi‑interface designs.
• Compact, high-pin package: 780‑BBGA (33×33 supplier variant) delivers a high I/O count in a space-efficient surface-mount footprint.
• Commercial temperature grade: Specified 0 °C to 85 °C operation for systems targeting commercial environments.
• Regulatory readiness: RoHS compliance supports lead‑free manufacturing and environmental requirements.

Why Choose 5SGXMA3E2H29C2LN?

This Stratix V GX FPGA provides a blend of large logic capacity, substantial embedded RAM, and high I/O density in a compact BGA package. It is positioned for commercial-grade systems that require significant on-chip resources and flexible interface options while maintaining defined electrical and thermal operating conditions.

Engineers and system designers looking for a high-capacity FPGA for complex digital logic, high‑I/O integration, or designs that reference Stratix V family electrical and transceiver specifications will find this part aligned with those needs. The device’s documented operating ranges and RoHS compliance support consistent manufacturing and deployment in commercial applications.

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