5SGXMA3E2H29C1WN

The 5SGXMA3E2H29C1WN is a Stratix® V GX field-programmable gate array (FPGA) from Intel, offered in a 780-ball BGA FCBGA package. It delivers high logic density and significant on-chip memory for complex digital designs that require many I/O and tight system integration.

Key attributes include 340,000 logic elements, approximately 19.5 Mbits of embedded memory, up to 600 I/O pins, a compact 780-HBGA (33×33) package, RoHS compliance, and a commercial operating range (0 °C to 85 °C). The device is suitable for designs that demand large programmable logic fabric and abundant embedded RAM in a surface-mount package.

Key Features

• Core Logic Density 340,000 logic elements enabling large, complex FPGA designs and high integration of digital functions.
• Embedded Memory Approximately 19.5 Mbits of on-chip RAM for buffering, packet processing, or working memory without immediate dependence on external DRAM.
• I/O Capacity Up to 600 user I/O pins to support wide datapaths, multi-protocol interfaces, and dense board-level connectivity.
• Power Supply Core voltage supply specified between 870 mV and 930 mV to match platform power-rail planning and enable predictable power budgeting.
• Package & Mounting 780-BBGA, FCBGA package (supplier package 780-HBGA, 33×33) designed for surface-mount assembly and compact board footprint.
• Commercial Temperature Grade Rated for 0 °C to 85 °C operation for standard commercial applications and environments.
• Standards Compliance RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• High-density digital processing — Use the large logic element count and on-chip memory to implement complex datapath engines, protocol handling, and custom processing blocks.
• Network and communications systems — The combination of abundant logic and extensive I/O supports packet handling, protocol bridging, and interface aggregation tasks.
• System integration and prototyping — Ideal for consolidating multiple functions into a single programmable device during development or for production-level system integration.
• Acceleration and offload — Implement hardware-accelerated functions that benefit from large LUT stages and embedded RAM to reduce latency and external memory traffic.

Unique Advantages

• High logic capacity: 340,000 logic elements allow large designs to be implemented in a single device, reducing board-level component count.
• Significant on-chip RAM: Approximately 19.5 Mbits of embedded memory lowers dependency on external memory for many buffering and state storage needs.
• Extensive I/O: Up to 600 I/O pins provide flexibility for wide data buses, multiple interfaces, and complex connectivity without external multiplexing.
• Compact surface-mount package: The 780-BBGA (33×33) package supports high-density mounting and a compact board footprint for space-constrained designs.
• Predictable power envelope: Defined core supply range (870 mV–930 mV) simplifies power-rail design and thermal planning.
• Commercial-grade reliability: Rated for 0 °C to 85 °C operation and RoHS compliance for standard commercial deployment and manufacturing practices.

Why Choose 5SGXMA3E2H29C1WN?

The 5SGXMA3E2H29C1WN positions itself as a high-density Stratix V GX FPGA option with a balance of logic capacity, on-chip memory, and large I/O count in a compact BGA package. It is suited to system designers and procurement teams targeting applications that require significant programmable resources and dense I/O in a surface-mount form factor.

Backed by Intel’s Stratix V family heritage and documented electrical characteristics, this device offers scalability for complex digital systems, deterministic power requirements, and a commercial-grade operating range for mainstream embedded and communications applications.

Request a quote or submit an inquiry for part number 5SGXMA3E2H29C1WN to receive pricing and availability information tailored to your project requirements.