5SGXMA3E1H29I2WN

The 5SGXMA3E1H29I2WN is a Stratix® V GX Field Programmable Gate Array (FPGA) IC in a 780-ball BGA package intended for industrial applications. It delivers high logic density, substantial on‑chip memory, and a large I/O count to support complex, high‑capacity digital designs.

Designed as part of the Stratix V GX family, this device targets markets requiring dense programmable logic, extensive embedded memory, and flexible I/O — including communications infrastructure, industrial control systems, and high‑performance processing platforms.

Key Features

• Logic capacity — 340,000 logic elements to implement large-scale digital functions and system-level integration.
• Embedded memory — approximately 19.456 Mbits of on‑chip RAM for packet buffering, FIFOs, and data‑path storage.
• I/O density — 600 user I/Os to interface with high‑pin‑count peripherals, multi‑lane links, and parallel buses.
• Package and mounting — 780‑BBGA (FCBGA) package; supplier device package listed as 780‑HBGA (33×33); surface‑mount mounting type for standard PCB assembly.
• Power — core voltage supply range 870 mV to 930 mV to match system power rails and regulator designs.
• Industrial temperature grade — specified operating range from −40 °C to 100 °C for deployment in industrial environments.
• Standards compliance — RoHS compliant for regulatory and manufacturing compatibility.
• Series capabilities — as a Stratix V GX family device, the series provides advanced transceiver and switching characteristics described in the Stratix V device documentation.

Typical Applications

• High‑capacity communications equipment — implement packet processing, protocol offload, and wide parallel interfaces using large logic and memory resources.
• Industrial control and automation — support complex control algorithms, sensor aggregation, and deterministic I/O handling across a wide temperature range.
• Data‑path and signal processing — implement FIR filters, protocol engines, and data buffering using abundant logic and embedded RAM.
• Prototyping and system integration — consolidate multiple functions into a single FPGA to reduce board count and accelerate development.

Unique Advantages

• High logic density: 340,000 logic elements enable integration of large designs and consolidation of multiple subsystems onto one device.
• Substantial on‑chip RAM: approximately 19.456 Mbits of embedded memory reduces external memory dependency for many buffering and storage tasks.
• Extensive I/O: 600 user I/Os provide flexibility to connect numerous peripherals, SERDES lanes, and parallel interfaces without external multiplexing.
• Industrial grade temperature range: −40 °C to 100 °C supports deployment in demanding environments where extended thermal performance is required.
• Flexible packaging: 780‑BBGA (FCBGA) in a 33×33HBGA footprint supports standard surface‑mount assembly while accommodating high pin counts.
• Energy‑focused core voltage: 870–930 mV core supply enables integration with modern low‑voltage power architectures.

Why Choose 5SGXMA3E1H29I2WN?

The 5SGXMA3E1H29I2WN combines high logic capacity, sizeable embedded memory, and a very large I/O complement in a surface‑mount BGA package targeted for industrial applications. It is suited to designs that require consolidation of complex digital functions, significant buffering, and broad external connectivity while operating across an extended temperature range.

For engineering teams pursuing scalable, modular system architectures, this Stratix V GX device offers a balance of density, memory, and I/O flexibility, backed by the device family documentation and ecosystem support described in the Stratix V datasheet.

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