5SGXMA3E1H29C2N

The 5SGXMA3E1H29C2N is a Stratix® V GX family Field Programmable Gate Array (FPGA) from Intel, supplied in a 780-BBGA FCBGA package. It provides a large programmable fabric, extensive on-chip memory, and a high I/O count for designs that require significant logic capacity and connectivity.

This commercial-grade device is targeted at electronic designs that demand large amounts of logic, embedded RAM, and numerous I/O channels while operating within a standard commercial temperature range and a sub-1V core supply range.

Key Features

• Programmable Fabric — Contains 340,000 logic elements and approximately 128,300 logic array blocks, providing substantial capacity for complex logic integration.
• Embedded Memory — Total on-chip RAM bits of 19,456,000, which corresponds to approximately 19.456 Mbits of embedded memory for data buffering and storage.
• I/O Capacity — Up to 600 user I/Os to support dense connectivity and interface requirements.
• Power and Supply — Core voltage supply range is specified from 870 mV to 930 mV, enabling operation within a narrow sub-1V core window.
• Package and Mounting — Supplied in a 780-BBGA FCBGA package (supplier device package: 780-HBGA, 33×33); surface-mount mounting type facilitates PCB assembly.
• Operating Conditions — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance — RoHS compliant, supporting regulatory material requirements.

Typical Applications

• High-density logic designs — Use the large programmable fabric (340,000 logic elements) for complex state machines, pipelines, and custom parallel processing engines.
• Memory-intensive functions — Leverage approximately 19.456 Mbits of embedded memory for buffering, large FIFOs, and on-chip data storage.
• High I/O connectivity — Utilize up to 600 I/Os for dense interface requirements such as parallel buses, multi-channel interfaces, or extensive sensor/actuator arrays.

Unique Advantages

• Large programmable capacity: 340,000 logic elements enable substantial on-chip integration and reduce the need for multiple devices.
• Significant on-chip RAM: Approximately 19.456 Mbits of embedded memory supports large buffers and data path storage without external memory in many use cases.
• High I/O count: 600 I/Os provide flexibility for complex interface layouts and multi-channel connectivity.
• Compact, industry-standard package: 780-BBGA FCBGA (780-HBGA, 33×33) supports high-density PCB designs and surface-mount assembly.
• Commercial operating range: Rated for 0 °C to 85 °C, suitable for standard commercial deployments.
• Regulatory compliance: RoHS compliant for material and environmental requirements.

Why Choose 5SGXMA3E1H29C2N?

The 5SGXMA3E1H29C2N positions itself as a high-capacity Stratix V GX FPGA for designs that require a large logic fabric, substantial embedded memory, and extensive I/O connectivity within a commercial operating environment. Its sub-1V core supply range and standard BGA packaging make it suitable for dense, performance-oriented PCB implementations.

Backed by Intel/Altera documentation and device specifications, this part is appropriate for engineering teams and procurement seeking a commercially rated, RoHS-compliant Stratix V GX device with clear electrical and mechanical parameters for system integration.

Request a quote or submit a procurement inquiry to obtain pricing, availability, and lead-time information for part number 5SGXMA3E1H29C2N.