5SGXMA3E1H29C2G

The 5SGXMA3E1H29C2G is a Stratix V GX family FPGA from Intel, supplied in a 780-ball BGA (FCBGA) surface-mount package (33 × 33 mm). It provides a large programmable fabric with extensive I/O and on-chip memory for complex, memory- and I/O-intensive designs.

This commercial-grade device (0 °C to 85 °C) combines a high logic element count and significant embedded RAM capacity with a low-voltage core supply range, making it suitable for dense board-level integration where high logic density and large I/O counts are required.

Key Features

• Programmable Fabric — 340,000 logic elements (logic cells) to implement complex custom logic and state machines.
• Logic Resources — 128,300 logic blocks reported for partitioning and hierarchical design structuring.
• Embedded Memory — Approximately 19.456 Mbits of on-chip RAM to support buffering, FIFOs, and memory-intensive algorithms.
• High I/O Density — 600 user I/Os to accommodate wide parallel interfaces and multiple high-pin-count peripherals.
• Package & Mounting — 780-BBGA (supplier package: 780-HBGA, 33 × 33) surface-mount FCBGA for compact, high-density PCB integration.
• Core Power — Core supply range from 870 mV to 930 mV to meet the device’s specified operating conditions.
• Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C, suitable for commercial and lab environments.
• Environmental Compliance — RoHS compliant, supporting restricted-substance requirements.
• Family Transceiver Capability (Stratix V GX) — Stratix V GX family transceivers support high-speed channel options (family-level data indicates support up to 14.1 Gbps depending on speed grade).

Typical Applications

• High-speed communications — Use the Stratix V GX family transceiver capability alongside abundant logic and I/O to implement serial links, protocol bridging, and packet processing.
• Memory- and compute-intensive FPGA designs — Leverage approximately 19.456 Mbits of embedded memory and 340,000 logic elements for buffering, acceleration blocks, and complex state machines.
• Dense I/O systems — 600 I/Os accommodate wide buses, multi-lane interfaces, and mixed parallel/serial subsystem integration on compact PCBs.

Unique Advantages

• Large programmable capacity: 340,000 logic elements enable implementation of sizable custom logic, reducing the need for multiple devices.
• Substantial on-chip memory: Approximately 19.456 Mbits of embedded RAM supports data buffering and memory-hungry functions without external memory for many use cases.
• Extensive I/O availability: 600 user I/Os simplify routing of high-pin-count peripherals and parallel interfaces, minimizing external glue logic.
• Compact BGA package: 780-ball FCBGA (33 × 33 mm) provides a high pin-count, board-space-efficient form factor for dense system designs.
• Low-voltage core operation: Core supply between 870 mV and 930 mV aligns with modern low-voltage system power architectures.
• Commercial grade and RoHS compliant: Rated for 0 °C to 85 °C operation and compliant with RoHS requirements for environmental consistency in commercial deployments.

Why Choose 5SGXMA3E1H29C2G?

The 5SGXMA3E1H29C2G places a large Stratix V GX FPGA fabric, significant embedded memory, and extensive I/O into a compact 780-BBGA package. Its combination of 340,000 logic elements, approximately 19.456 Mbits of on-chip RAM, and 600 I/Os makes it well suited for designers building complex, memory- and I/O-intensive systems that require dense integration.

Backed by Intel’s Stratix V family documentation, this device is positioned for commercial applications that demand high logic capacity, substantial embedded memory, and a high pin count in a surface-mount BGA form factor.

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