5SGXMA3E1H29C1WN

The 5SGXMA3E1H29C1WN is a Stratix V GX family FPGA in a 780‑BBGA (33×33) FCBGA package provided for commercial applications. It offers a large logic fabric and embedded memory along with a high I/O count, enabling dense digital designs and complex board-level integration.

Key device attributes include 340,000 logic elements, approximately 19.456 Mbits of on‑chip RAM, 600 I/O pins, and an operating supply range of 870 mV to 930 mV. The device is RoHS compliant and specified for commercial temperature operation from 0 °C to 85 °C.

Key Features

• Logic Capacity  340,000 logic elements for implementing large combinational and sequential logic networks.
• Embedded Memory  Approximately 19.456 Mbits of on‑chip RAM to support buffering, lookup tables, and memory‑intensive functions.
• I/O Resources  600 I/O pins to accommodate high‑pin‑count interfacing and multi‑channel connectivity.
• Package & Mounting  780‑BBGA (FCBGA) package (supplier package: 780‑HBGA, 33×33) in a surface‑mount form factor for compact board layouts.
• Power Supply  Core voltage supply specified from 870 mV to 930 mV to match board power delivery design requirements.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C, suitable for commercial electronics deployments.
• Standards Compliance  RoHS compliant for environmental and regulatory alignment.

Typical Applications

• High‑density logic systems  Use the device’s 340,000 logic elements to implement complex state machines, accelerators, and glue logic in compute‑intensive designs.
• Memory‑centric functions  Leverage approximately 19.456 Mbits of embedded RAM for large FIFO buffers, packet buffering, and on‑chip data storage.
• Multi‑interface platforms  The 600 I/O pins support designs requiring numerous parallel interfaces, high channel counts, or extensive external device connectivity.
• Compact board designs  The 780‑BBGA surface‑mount package allows high integration density for space‑constrained systems.

Unique Advantages

• Large programmable fabric  Enables consolidation of multiple functions into a single device, reducing board complexity and part count.
• Significant on‑chip memory  Helps reduce external memory dependency and improves data throughput for buffering and temporary storage tasks.
• High I/O density  Facilitates integration of many peripherals and interfaces without additional I/O expanders.
• Commercial temperature rating  Provides a predictable operating range for general electronics and industrial‑lite applications.
• RoHS compliance  Simplifies regulatory compliance for end products in regions requiring lead‑free components.

Why Choose 5SGXMA3E1H29C1WN?

5SGXMA3E1H29C1WN positions itself as a high‑capacity Stratix V GX FPGA option for designs that require a substantial logic budget, ample embedded memory, and extensive I/O in a single surface‑mount package. Its specification of core voltage (870–930 mV) and commercial temperature range make it suitable for a broad range of commercial electronic systems.

This device is appropriate for engineering teams building dense digital systems, multi‑interface platforms, or designs that benefit from consolidating functions into a single, RoHS‑compliant FPGA. Its resource balance supports scaled designs while maintaining compatibility with the Stratix V GX device family characteristics described in the device datasheet.

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