5SGXMA3E1H29C1N

The 5SGXMA3E1H29C1N is a Stratix V GX family Field Programmable Gate Array (FPGA) designed for commercial applications that require very high logic density and extensive on-chip memory. It combines a large logic fabric with significant embedded RAM and a high pin count to support complex digital designs.

Key hardware characteristics include 340,000 logic elements, approximately 19.5 Mbits of embedded memory, 600 user I/Os, a 780-ball BGA package, and a core supply voltage range of 0.870 V to 0.930 V. The device is RoHS-compliant and specified for commercial operating temperatures (0 °C to 85 °C).

Key Features

• Core Logic  340,000 logic elements provide a very high-density programmable fabric for complex algorithms and datapaths.
• Embedded Memory  Approximately 19.5 Mbits of on-chip RAM to support large buffers, state machines, and memory-intensive logic functions.
• I/O Capacity  600 I/O pins to enable dense board-level connectivity and interface integration.
• Package and Mounting  780-ball BBGA (FCBGA) package with supplier package dimension 33 × 33 mm; surface-mount construction for PCB assembly.
• Power and Core Voltage  Core supply voltage specified from 0.870 V to 0.930 V to match low-voltage system designs.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C for standard commercial applications.
• Regulatory Compliance  RoHS-compliant to support environmentally conscious manufacturing and supply chains.
• Electrical and Switching Characteristics  Device family documentation covers electrical characteristics, switching behavior, I/O timing, and programmable I/O/periphery performance.

Typical Applications

• High-density logic systems  Implement large-scale custom logic, state machines, and complex signal processing where significant programmable resources are required.
• Systems requiring large on-chip RAM  Use the embedded memory for buffering, packet storage, and intermediate data staging in dataflow designs.
• Dense I/O applications  Integrate multiple parallel interfaces and board-level peripherals using the device’s 600 I/Os.

Unique Advantages

• High integration density: 340,000 logic elements plus substantial on-chip RAM reduce the need for external logic and memory components.
• Large I/O count: 600 user I/Os enable complex system integration and reduce external multiplexing or bridge components.
• Compact system footprint: 780-BBGA package (33 × 33 mm supplier package) provides a dense form factor for space-constrained PCBs.
• Low-voltage core operation: 0.870 V–0.930 V supply range aligns with modern low-voltage platform designs.
• Commercial readiness: Rated for 0 °C to 85 °C operation and RoHS-compliant for standard commercial production environments.
• Comprehensive device documentation: Family datasheet details electrical, switching, and I/O timing characteristics to aid design and validation.

Why Choose 5SGXMA3E1H29C1N?

The 5SGXMA3E1H29C1N offers a balance of very high logic capacity, substantial embedded memory, and a large I/O complement in a compact 780-ball BGA package. Its core voltage range and commercial temperature rating make it suitable for demanding commercial designs that require tight integration of logic and memory on a single device.

This part is well-suited to teams building complex digital systems that need on-chip resources to reduce BOM and board complexity while relying on detailed family-level electrical and timing documentation for implementation and validation.

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