5SGXEBBR3H43I3N

The 5SGXEBBR3H43I3N is a Stratix® V GX family FPGA designed for high-density, high‑integration digital systems. This device provides 952,000 logic elements and approximately 53.25 Mbits of on‑chip RAM, making it suitable for complex custom logic, signal processing, and multi‑interface designs.

Built for industrial environments, the device supports a core supply range of 820 mV to 880 mV, up to 600 I/Os, and an operating temperature range of −40 °C to 100 °C. It ships in a high‑pin‑count 1760‑BBGA (FCBGA) package and is RoHS compliant.

Key Features

• Core density  952,000 logic elements and 359,200 logic blocks provide large programmable fabric for complex algorithms and parallel processing.
• Embedded memory  Approximately 53.25 Mbits of total on‑chip RAM to support frame buffers, FIFOs, and large on‑chip data structures without immediate external memory needs.
• I/O capacity  Up to 600 user I/Os to accommodate wide parallel interfaces, multiple peripherals, and complex board routing requirements.
• Power  Core supply voltage specified from 820 mV to 880 mV for the device core.
• Package & mounting  1760‑BBGA (FCBGA) package; supplier device package listed as 1760‑HBGA (45 × 45). Surface‑mount device suitable for high‑density PCB integration.
• Temperature & grade  Industrial temperature grade with operating range −40 °C to 100 °C for deployment in temperature‑sensitive environments.
• Standards & compliance  RoHS compliant.
• Series capabilities  As a Stratix V GX family device, the series documentation covers GX transceiver speed grades and detailed electrical and switching characteristics for system design reference.

Typical Applications

• High‑density signal processing  Large logic and embedded RAM capacity enable implementation of custom DSP pipelines and packet processing engines.
• Multi‑interface bridging  Up to 600 I/Os support wide parallel interfaces, multiple serial links, and complex protocol bridges without extensive external glue logic.
• Networking and communications  Part of the Stratix V GX family with documented transceiver capabilities in the series, suitable for high‑bandwidth serial and communication functions where series specifications apply.
• Industrial control systems  Industrial temperature rating and surface‑mount 1760‑BBGA packaging fit ruggedized control and automation platforms.

Unique Advantages

• High logic integration: 952,000 logic elements reduce external ASIC/FPGA count and consolidate multi‑function systems into a single device.
• Substantial on‑chip memory: Approximately 53.25 Mbits of embedded RAM lowers dependence on external memory, simplifying board design and improving data locality.
• Large I/O complement: 600 I/Os allow flexible interfacing to sensors, memory, and host systems without extensive I/O multiplexing.
• Industrial readiness: Rated for −40 °C to 100 °C operation to meet the demands of industrial and temperature‑sensitive deployments.
• High‑density packaging: 1760‑BBGA (FCBGA) package supports the device’s large pin count in a compact footprint for dense PCB layouts.
• Standards compliance: RoHS compliance supports regulatory and manufacturing requirements.

Why Choose 5SGXEBBR3H43I3N?

The 5SGXEBBR3H43I3N combines high logic density, abundant embedded memory, and a large number of I/Os in an industrial‑grade Stratix V GX device. It is well suited for designers who need considerable on‑chip resources for complex algorithms, multi‑channel interfaces, and robust operation across a wide temperature range.

As part of the Stratix V GX family, this device benefits from the family‑level documentation of electrical and switching characteristics, enabling detailed system‑level design and verification for demanding applications.

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