5SGXEBBR3H43I3LG

The 5SGXEBBR3H43I3LG is a Stratix V GX field-programmable gate array (FPGA) in a 1760-BBGA FCBGA package. It provides a large programmable fabric combined with substantial on-chip memory and a high I/O count for demanding, high-density digital designs.

Targeted at industrial-grade deployments, this device combines 952,000 logic elements, approximately 53.248 Mbits of embedded memory, and up to 600 I/Os, while supporting an operating temperature range of –40 °C to 100 °C and a core voltage supply between 820 mV and 880 mV.

Key Features

• Core Logic  Provides 952,000 logic elements for complex programmable logic implementations and large-scale designs.
• Embedded Memory  Approximately 53.248 Mbits of on-chip RAM (total RAM bits: 53,248,000) to support data buffering, lookup tables, and memory-intensive functions.
• I/O Capacity  Up to 600 I/Os to support wide peripheral connectivity and dense board-level interfacing.
• Power Supply  Core voltage supply specified from 820 mV to 880 mV to match system power budgets and board power design.
• Package and Mounting  1760-BBGA (FCBGA) package; supplier device package listed as 1760-HBGA (45×45). Surface-mount mounting type.
• Industrial Temperature Grade  Rated for operation from –40 °C to 100 °C, suitable for temperature-demanding environments.
• Standards Compliance  RoHS compliant.
• Documentation  Datasheet for the Stratix V family includes electrical and switching characteristics, operating conditions, and I/O timing details.

Typical Applications

• Large-scale digital systems  Implement complex custom logic where a high count of logic elements (952,000) is required for compute or control functions.
• Memory-intensive designs  Use the approximately 53.248 Mbits of on-chip RAM for buffering, packet processing, or LUT-based implementations.
• High-density I/O interfacing  Deploy in systems requiring many external interfaces or parallel connections, leveraging up to 600 I/Os.
• Industrial equipment  Suitable for industrial-temperature applications that require operation across –40 °C to 100 °C and surface-mount assembly.

Unique Advantages

• Large programmable fabric: 952,000 logic elements provide the capacity to implement large custom architectures and consolidate multiple functions into a single device.
• Substantial on-chip memory: Approximately 53.248 Mbits of embedded RAM reduces external memory dependence and simplifies board design for memory-heavy tasks.
• High I/O density: Up to 600 I/Os enable broad peripheral connectivity and support for parallel data paths or dense interface requirements.
• Industrial temperature rating: Operation from –40 °C to 100 °C addresses thermal requirements for industrial deployments.
• Compact, surface-mount package: 1760-BBGA (FCBGA) package with a 45×45 supplier package dimension option supports compact PCB layouts.
• Regulatory friendliness: RoHS compliance supports environmental and manufacturing requirements.

Why Choose 5SGXEBBR3H43I3LG?

The 5SGXEBBR3H43I3LG combines very high logic density, significant embedded memory, and a high I/O count in an industrial-temperature, surface-mount FCBGA package. These attributes make it well suited for designs that need to consolidate complex logic, on-chip data storage, and extensive external interfacing into a single FPGA device.

For engineering teams building industrial-grade systems that require a verified device datasheet and clear electrical characteristics (including operating conditions and I/O timing), this Stratix V GX device offers a specification-driven choice with long-term design stability.

If you would like pricing, availability, or a formal quote for 5SGXEBBR3H43I3LG, submit a request with your quantity and delivery requirements and our team will respond with next steps.