5SGXEBBR3H43I3L

The 5SGXEBBR3H43I3L is a Stratix V GX FPGA IC offering a very large logic fabric and substantial on-chip memory for demanding programmable designs. It provides 952,000 logic elements, approximately 53.25 Mbits of embedded memory, and up to 600 user I/O in a 1760-ball BGA surface-mount package intended for industrial-grade applications.

This device targets designs that require high logic capacity, significant embedded RAM, and extensive I/O routing, while operating from a low core supply range (820 mV to 880 mV) and across an industrial temperature range (–40 °C to 100 °C).

Key Features

• Core Logic Capacity 952,000 logic elements provide very large programmable logic resources for complex digital systems.
• Embedded Memory Approximately 53.25 Mbits of on-chip RAM to support large buffering, lookup tables, and memory-intensive algorithms.
• I/O Density Up to 600 user I/O pins to support diverse signaling and high pin-count system integration.
• Power Core voltage supply specified between 820 mV and 880 mV for core power planning and supply design.
• Package & Mounting 1760-ball BGA (supplier device package: 1760-HBGA, 45×45) in a surface-mount form factor suitable for high-density PCB designs.
• Industrial Temperature Grade Rated for operation from –40 °C to 100 °C, matching industrial-environment requirements.
• RoHS Compliance Device is RoHS compliant for environmental and regulatory conformance.

Typical Applications

• High-density programmable logic implementations — Large designs that require hundreds of thousands of logic elements can leverage the device’s 952,000 logic-element capacity.
• Memory-intensive processing — Use cases requiring substantial on-chip RAM benefit from approximately 53.25 Mbits of embedded memory for buffering and workspace.
• I/O-heavy systems — Designs that need extensive external interfacing or parallel data paths can utilize the device’s up to 600 user I/O pins.
• Industrial applications — The –40 °C to 100 °C operating range and industrial grade make the part suitable for deployments in extended-temperature environments.

Unique Advantages

• Very large logic fabric: 952,000 logic elements enable complex, partitioned designs without immediate need for multiple devices.
• Substantial on-chip RAM: Approximately 53.25 Mbits of embedded memory reduces dependence on external memory for many use cases.
• High I/O count: Up to 600 I/O pins simplify board-level integration for dense connectivity requirements.
• Industrial temperature capability: Specified operation from –40 °C to 100 °C supports extended-environment deployments.
• Compact BGA package: 1760-ball HBGA (45×45) surface-mount package balances high pin-count with PCB area efficiency.
• Regulatory compliance: RoHS-compliant construction aligns with common environmental and manufacturing requirements.

Why Choose 5SGXEBBR3H43I3L?

The 5SGXEBBR3H43I3L positions itself as a high-capacity Stratix V GX FPGA for designs demanding very large logic and embedded memory resources alongside high I/O density. Its industrial temperature rating and RoHS compliance make it suitable for extended-environment systems where reliability and regulatory conformance matter.

For system architects and engineers building complex, memory- and I/O-intensive FPGA designs, this device offers the scale and package options to consolidate functionality and manage board-level integration while adhering to industrial operating conditions and documented device electrical characteristics.

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