5SGXEBBR3H43C3N

The 5SGXEBBR3H43C3N is a Stratix® V GX Field Programmable Gate Array from Intel, provided as a commercial-grade, surface-mount FCBGA device. It delivers a large programmable fabric with high on-chip memory and dense I/O to address complex logic and high-bandwidth designs.

With 952,000 logic elements and approximately 53.25 Mbits of embedded RAM, this device targets applications requiring substantial logic capacity, significant embedded memory, and extensive I/O connectivity while operating within a commercial temperature range.

Key Features

• Core Logic  952,000 logic elements provide a large programmable fabric for implementing complex digital functions and system-level integration.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM for buffering, FIFOs, and memory-intensive processing without external memory dependence.
• I/O Density  600 user I/O pins to support wide bus interfaces, parallel data paths, and high-pin-count connectivity.
• Transceiver Capability (Family-Level)  The Stratix V GX family (per device series datasheet) offers transceiver speed grades up to 14.1 Gbps, enabling high-speed serial interfaces where required by the design.
• Power and Voltage  Core voltage supply specified from 820 mV to 880 mV to match system power-rail planning for Stratix V devices.
• Package & Mounting  1760-BBGA (FCBGA) package, supplier device package 1760-HBGA (45×45), surface-mount mounting for compact board-level integration.
• Commercial Temperature Grade  Rated for 0°C to 85°C operation, suitable for commercial-environment applications.
• RoHS Compliance  Device is RoHS compliant to meet environmental and manufacturing requirements.

Typical Applications

• High-bandwidth Networking  Leverage the high I/O count and Stratix V GX series transceiver capabilities for switching, routing, and line-card designs requiring dense connectivity and serial links.
• Data Processing & Acceleration  Use the large logic fabric and ~53 Mbits of embedded RAM for hardware acceleration, packet processing, and custom datapath implementations.
• Video and Imaging Systems  Implement real-time video pipelines and multi-channel image processing with the device’s memory and logic resources for buffering and parallel processing.

Unique Advantages

• Large Programmable Fabric: 952,000 logic elements allow consolidation of multiple functions into a single device, reducing board-level component count.
• Substantial On‑Chip Memory: Approximately 53.25 Mbits of embedded RAM supports large buffers and local storage for deterministic, low-latency processing.
• High I/O Count: 600 I/Os enable broad external interfacing options for parallel buses and multi-channel systems without extensive external multiplexing.
• Commercial Temperature Rating: Specified 0°C to 85°C operation aligns with standard commercial deployment environments.
• Compact Ball Grid Package: 1760-BBGA / 1760-HBGA (45×45) FCBGA package supports high-density PCB layouts while maintaining robust soldered mounting.
• Regulatory Compliance: RoHS compliance supports environmentally conscious manufacturing and supply-chain requirements.

Why Choose 5SGXEBBR3H43C3N?

The 5SGXEBBR3H43C3N combines a very large logic capacity, significant embedded RAM, and a high I/O count in a compact FCBGA package to address demanding commercial applications that require integration of complex functionality on a single device. Its commercial temperature rating and RoHS compliance make it suitable for standard commercial deployments.

This Stratix V GX device is appropriate for engineering teams building high-throughput networking, data-acceleration, and real-time processing systems that benefit from extensive on-chip resources and dense external connectivity. Support materials and the device series datasheet provide the series-level electrical and transceiver characteristics referenced for system design.

Request a quote or submit an inquiry today to discuss availability, lead times, and design support for integrating the 5SGXEBBR3H43C3N into your next project.