5SGXEBBR3H43C2LG

The 5SGXEBBR3H43C2LG is a Stratix V GX Field Programmable Gate Array (FPGA) IC designed for high-density, high‑integration digital designs. It delivers a substantial logic fabric and on‑chip RAM to support complex processing, buffering, and glue‑logic tasks within commercial temperature environments.

As a member of the Stratix V family, the device follows the electrical and switching characteristic definitions provided in the Stratix V device documentation and is targeted at applications that require significant logic capacity, extensive I/O, and embedded memory resources.

Key Features

• Core Logic Capacity  952,000 logic elements (cells), providing broad programmable resources for complex digital functions and custom compute pipelines.
• Embedded Memory  Approximately 53.25 Mbits of on‑chip RAM to support large buffering, lookup tables, and state storage without external memory dependence.
• I/O Density  600 user I/Os for extensive external interfacing and board‑level connectivity.
• Power and Voltage  Core voltage supply range of 820 mV to 880 mV, consistent with the device's electrical specification envelope.
• Package and Mounting  1760‑BBGA (FCBGA) package; supplier device package listed as 1760‑HBGA (45×45). Device is surface mount compatible for standard PCB assembly.
• Operating Grade and Temperature  Commercial grade device rated for 0 °C to 85 °C operating temperature.
• Standards Compliance  RoHS compliant.
• Stratix V Family Documentation  Electrical and switching characteristics for the Stratix V family are defined in the Stratix V device datasheet, which covers core, periphery, and I/O timing behavior.

Typical Applications

• High‑density digital processing  Large logic capacity supports implementation of complex finite state machines, datapaths, and custom accelerators within a single device.
• Memory‑intensive designs  Approximately 53.25 Mbits of embedded memory is suitable for on‑chip buffering, large LUTs, and temporary storage needs.
• Dense I/O interfacing  600 I/Os enable aggregation of multiple external interfaces, sensors, or parallel data streams at board level.
• Commercial networking and compute equipment  Commercial temperature rating and package options make the device suitable for enterprise and communications equipment operating in standard environment ranges.

Unique Advantages

• Significant programmable resources: The 952,000 logic elements give designers scope to implement large, integrated systems without partitioning across multiple FPGAs.
• On‑chip memory footprint: Approximately 53.25 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage tasks, simplifying board design.
• High I/O count: 600 I/Os provide flexibility for dense connectivity and complex peripheral integration.
• Surface‑mount package flexibility: 1760‑BBGA/1760‑HBGA package options permit tight board layouts while supporting high pin counts.
• Commercial grade availability: Rated for 0 °C to 85 °C, aligning with standard commercial product deployment and system integration workflows.
• Regulatory alignment: RoHS compliance supports environmental and manufacturing requirements.

Why Choose 5SGXEBBR3H43C2LG?

The 5SGXEBBR3H43C2LG delivers a balanced combination of large logic capacity, substantial embedded memory, and a high I/O count packaged in a 1760‑ball BGA format. These characteristics make it well suited for engineers designing complex, memory‑heavy functions and dense interface hubs within commercial products.

Backed by the Stratix V family documentation for electrical and switching characteristics, this device supports design teams that prioritize integration density, on‑chip memory, and extensive board‑level connectivity while maintaining standard commercial operating conditions.

Request a quote or submit a product inquiry to evaluate pricing and availability for the 5SGXEBBR3H43C2LG for your next design.