5SGXEBBR3H43C2G

The 5SGXEBBR3H43C2G is an Intel Stratix® V GX FPGA in a 1760-BBGA (FCBGA) package offering very large logic and embedded memory resources for advanced programmable designs. This device delivers a combination of high logic capacity, substantial on-chip RAM, and extensive I/O to support complex, high-density FPGA implementations.

Built for commercial-temperature applications, the device provides defined operating conditions and vendor documentation for speed grades and transceiver options within the Stratix V GX family; consult the device datasheet for detailed electrical and switching characteristics.

Key Features

• High Logic Capacity — 952,000 logic elements to implement large-scale programmable logic and complex state machines.
• Substantial Embedded Memory — Approximately 53.25 Mbits of on-chip RAM to support buffering, on-chip data storage, and high-throughput processing.
• Extensive I/O — 600 I/O pins for broad external connectivity and flexible board-level interfacing.
• Package and Mounting — 1760-BBGA (FCBGA) package; supplier device package 1760-HBGA (45×45 mm); surface-mount mounting type for compact system integration.
• Power and Voltage — Core supply range of 870 mV to 930 mV, enabling defined power delivery for the core fabric.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for standard commercial applications.
• Standards Compliance — RoHS compliant to meet common environmental and manufacturing requirements.
• Manufacturer Support — Part of the Stratix V family with documented electrical and switching characteristics in the Intel/Altera datasheet for device-level integration guidance.

Typical Applications

• High-density programmable logic — Use the device where large logic element counts and significant on-chip RAM are required to implement complex algorithms and control logic.
• Data buffering and packet processing — Leverage the approximately 53.25 Mbits of embedded memory for on-chip buffering, queues, and intermediate data storage.
• System I/O aggregation — Employ the 600 I/O pins to consolidate multiple external interfaces and high-pin-count peripheral connectivity on a single FPGA.

Unique Advantages

• High integration density: 952,000 logic elements and ~53.25 Mbits of RAM reduce the need for external logic and memory components.
• Broad I/O complement: 600 I/Os provide flexibility in interface selection and board-level partitioning.
• Compact FCBGA packaging: 1760-BBGA / 1760-HBGA (45×45 mm) package supports high pin-count designs in a manageable footprint.
• Defined operating envelope: Commercial temperature rating (0 °C to 85 °C) and a specified core voltage range (870 mV–930 mV) simplify thermal and power planning.
• Regulatory and manufacturing readiness: RoHS compliance supports mainstream manufacturing and environmental requirements.
• Backed by Stratix V documentation: Device-level electrical and switching characteristics are available in the manufacturer's datasheet for design verification and integration.

Why Choose 5SGXEBBR3H43C2G?

The 5SGXEBBR3H43C2G positions itself as a high-capacity Stratix V GX FPGA option when large logic density and substantial embedded memory are primary design drivers. Its combination of nearly one million logic elements, tens of megabits of on-chip RAM, and a 600-pin I/O complement enables consolidation of complex functions into a single programmable device.

Designed for commercial-temperature systems and supported by Intel/Altera Stratix V documentation, this device is suitable for engineers and teams needing a robust, well-documented FPGA building block for large programmable designs where integration density, I/O flexibility, and on-chip memory are critical.

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