5SGXEBBR2H43I3N

The 5SGXEBBR2H43I3N is a Stratix V GX field programmable gate array (FPGA) IC from Intel. It provides a high-density, reconfigurable logic platform suitable for complex digital designs that require significant on-chip logic, memory, and I/O capacity.

This device targets applications that demand large logic integration and extensive connectivity while operating across industrial temperature ranges and low core voltages.

Key Features

• Logic Capacity 952,000 logic elements for dense integration of custom logic and control functions.
• Embedded Memory Approximately 53.248 Mbits of on-chip RAM (total RAM bits: 53,248,000) to support buffering, caching, and local data storage.
• I/O Density 600 user I/O pins to handle wide parallel interfaces and multiple external peripherals.
• Package & Mounting 1760-BBGA, FCBGA package (supplier device package: 1760-HBGA, 45×45) with surface-mount assembly for compact board integration.
• Core Voltage Range Operates at a core supply range of 820 mV to 880 mV, suitable for low-voltage FPGA core operation.
• Industrial Grade & Temperature Range Rated Grade: Industrial with an operating temperature range of −40°C to 100°C for deployment in temperature-challenging environments.
• Standards & Compliance RoHS compliant, reflecting adherence to common materials and environmental directives.
• Transceiver Speed Grades (Series Reference) Stratix V GX devices include documented transceiver speed grades in the Stratix V device datasheet that define available channel speed options for the series.

Typical Applications

• Reconfigurable hardware acceleration Use the device as a programmable accelerator for compute and control functions that benefit from dense logic and on-chip memory.
• High-density digital integration Consolidate multiple logic functions into a single device leveraging the 952,000 logic elements and substantial embedded RAM.
• I/O-intensive systems Systems that require broad external connectivity can exploit the 600 I/O pins for parallel interfaces and multiple peripherals.

Unique Advantages

• High logic integration: 952,000 logic elements reduce the need for multiple devices, simplifying system architecture.
• Substantial on-chip memory: Approximately 53.248 Mbits of RAM enables larger local buffers and state storage without external memory.
• Extensive external connectivity: 600 I/O pins provide flexibility for multi-channel interfaces and dense system I/O requirements.
• Industrial temperature rating: −40°C to 100°C operation supports deployment in demanding environmental conditions.
• Compact package footprint: 1760-BBGA/1760-HBGA packaging allows high-density board designs while supporting surface-mount assembly.
• Low-voltage core operation: 820–880 mV core supply range aligns with modern low-voltage design practices.

Why Choose 5SGXEBBR2H43I3N?

The 5SGXEBBR2H43I3N combines very high logic density, significant on-chip RAM, and large I/O capacity in a compact, industrial-grade package. It is well suited for designers who need to consolidate complex digital functions into a single FPGA while maintaining broad connectivity and operating across a wide temperature range.

Backed by the Stratix V device documentation, this device is appropriate for development of high-density, reconfigurable hardware solutions where integration, predictable electrical characteristics, and industrial operating range are required.

Request a quote or submit a pricing and availability inquiry for part number 5SGXEBBR2H43I3N to begin evaluating this Stratix V GX FPGA for your design needs.