5SGXEBBR3H43C2L

The 5SGXEBBR3H43C2L is a Stratix® V GX field-programmable gate array (FPGA) device offering very high logic density and large on-chip memory. It integrates 952,000 logic elements and approximately 53 Mbits of embedded memory in a 1760-BBGA (45 × 45 mm) surface-mount package, and exposes 600 user I/O pins.

Built for commercial-grade systems, this Stratix V GX device is intended for designs that require high-capacity programmable logic, substantial embedded RAM, and large I/O connectivity within a compact FCBGA footprint. The device is RoHS compliant and operates from 820 mV to 880 mV core supply with an ambient operating range of 0 °C to 85 °C.

Key Features

• Core & logic density  952,000 logic elements provide a high-capacity programmable fabric for complex logic and datapath implementations.
• Embedded memory  Approximately 53 Mbits of on-chip RAM to support large buffers, FIFOs, and memory-intensive functions.
• I/O capability  600 user I/O pins to support broad peripheral connectivity and wide data buses.
• Package & mounting  1760-BBGA (FCBGA) supplier device package (1760-HBGA, 45×45) optimized for high-density board integration; surface-mount mounting type.
• Power and voltage  Core supply range specified at 820 mV to 880 mV to match system power-rail planning and thermal design.
• Commercial temperature grade  Rated for operation from 0 °C to 85 °C for commercial applications.
• Standards compliance  RoHS compliant for environmental and regulatory alignment.

Typical Applications

• High-density logic integration  Use where large numbers of programmable logic elements are required for complex algorithms and custom datapaths.
• Memory-intensive designs  Embedded memory capacity supports buffering, packet processing, and on-chip data storage needs.
• High-pin-count interfaces  600 I/Os enable wide parallel buses, multi-channel interfaces, and extensive peripheral connectivity.
• Commercial networking and compute modules  Suitable for commercial-grade modules that require substantial programmable logic and I/O density within an FCBGA package.

Unique Advantages

• Very high logic capacity: 952,000 logic elements let designers implement large-scale, performance-oriented logic on a single device, reducing system complexity.
• Substantial on-chip RAM: Approximately 53 Mbits of embedded memory supports large buffers and reduces dependency on external memory components.
• Extensive I/O resources: 600 user I/Os provide design flexibility for multi-channel interfaces and wide data paths without requiring external GPIO expanders.
• Compact, manufacturable package: 1760-BBGA (45 × 45 mm) surface-mount package balances board area and integration density for production designs.
• Commercial operating range: 0 °C to 85 °C rating makes the device suitable for a wide range of commercial and enterprise deployments.
• RoHS compliant: Meets RoHS requirements for environmentally responsible product design.

Why Choose 5SGXEBBR3H43C2L?

The 5SGXEBBR3H43C2L positions itself as a high-density Stratix V GX FPGA option for designers who need a large programmable fabric, significant embedded memory, and extensive I/O in a single FCBGA package. Its combination of 952,000 logic elements, approximately 53 Mbits of on-chip RAM, and 600 I/O pins addresses demanding commercial applications where consolidation of logic and memory onto one device reduces BOM and simplifies board-level design.

Engineers selecting this device benefit from quantifiable hardware resources and package characteristics that support scalable, production-ready designs within the commercial temperature range. Its RoHS compliance further supports regulatory and manufacturing requirements.

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