5SGXEBBR3H43C3G

The 5SGXEBBR3H43C3G is a Stratix® V GX Field Programmable Gate Array (FPGA) manufactured by Intel. It delivers very large programmable logic capacity and substantial on‑chip memory in a single surface‑mount FCBGA package.

With 952,000 logic elements, approximately 53.25 Mbits of embedded RAM, 600 user I/O pins, and a supplied package size of 1760‑HBGA (45×45), this device targets designs that require high logic density, extensive embedded memory, and wide I/O count while operating within a commercial temperature range.

Key Features

• Core Logic Capacity — 952,000 logic elements (cells) to implement large, complex programmable logic designs.
• Embedded Memory — Approximately 53.25 Mbits of on‑chip RAM (53,248,000 bits) for buffering, data storage, and implemented accelerators.
• High I/O Count — 600 available I/O pins to support extensive interfacing and parallel connectivity.
• Power — Voltage supply range specified at 820 mV to 880 mV, enabling defined power design and provisioning.
• Package & Mounting — 1760‑BBGA, FCBGA package; supplier device package listed as 1760‑HBGA (45×45); surface‑mount mounting for PCB integration.
• Commercial Grade & Temperature Range — Commercial grade device rated for operation from 0 °C to 85 °C.
• Datasheet Guidance — Device electrical and switching characteristics, operating conditions, and I/O timing are documented in the Stratix V device datasheet for detailed design reference.

Typical Applications

• High‑density programmable logic designs — Deploy the device where sizeable logic capacity and substantial embedded memory are required in a single FPGA.
• Complex I/O and interface aggregation — Use the 600 I/O pins to consolidate multiple parallel or serial interfaces and perform protocol bridging.
• Prototype and production systems with surface‑mount BGA — The 1760 FCBGA package supports compact PCB integration for production and evaluation boards within commercial temperature ranges.

Unique Advantages

• Extensive programmable resources — Nearly one million logic elements provide headroom for large finite state machines, datapath implementations, and custom accelerators.
• Large on‑chip memory — Approximately 53.25 Mbits of embedded RAM reduces dependency on external memory for many buffering and local storage needs.
• High port count — 600 I/O simplifies board-level routing by accommodating many direct interfaces without extensive multiplexing.
• Compact BGA packaging — 1760‑HBGA (45×45) surface‑mount package enables dense board layouts while keeping the device footprint defined and consistent.
• Clear electrical envelope — Published voltage supply range and commercial temperature rating allow predictable system power and thermal planning.

Why Choose 5SGXEBBR3H43C3G?

The 5SGXEBBR3H43C3G positions itself as a high‑capacity Stratix V GX FPGA option for designs that need a combination of very large logic resources, plentiful embedded RAM, and broad I/O connectivity within a defined commercial operating window. Its package and surface‑mount form factor support compact PCB implementations and production workflows.

Engineers selecting this device benefit from precise electrical and switching characteristic documentation in the Stratix V datasheet, enabling informed power budgeting, timing analysis, and system integration planning.

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